Abstract: Disclosed are a side emitting lens, a light emitting device using the side emitting lens, a mold assembly for preparing the side emitting lens and a method for preparing the side emitting using the mold assembly. The lens of the present invention has a simple structure so the lens is easily fabricated through a molding process. If the lens is applied to the light emitting member, light generated from the light emitting member is laterally guided by means of the lens.

Abstract: Disclosed is an LED device, a method for manufacturing the same, and a light emitting apparatus having the same. The LED device includes (a) a light emitting diode unit and (b) an adjustment layer laminated on a light emitting surface of the light emitting diode unit, a fine pattern having being formed on the adjustment layer by repeating a shape in a light emission direction. The adjustment layer is (i) at least one layer formed by aligning transparency adjustment particles having a shape or (ii) a polymer film layer having a fine pattern imprinted on the polymer film layer so as to adjust transparency. A fine pattern adjustment layer having various shapes and an adjustable size is introduced on the light emitting surface of the LED unit. As a result, the light extraction efficiency of the surface of the LED unit improves together with ease of manufacturing and secured uniformity.

Abstract: A method for fabricating an LED having section grown on a sapphire substrate, a boded structure, and a unit chip separated from the bonded structure. The method includes (a) bonding the section grown on a first surface of the sapphire substrate to a first surface of a first substrate with a first binder; (b) bonding a second surface of the first substrate to a first surface of a second substrate with a second binder; (c) removing the second substrate from a bonded structure obtained as a result of step (b) after polishing a second surface of the sapphire substrate; (d) separating the bonded structure into unit chips after the second substrate has been removed; and (e) bonding the second surface of the polished sapphire substrate provided in each unit chip to a lead frame, and removing the first substrate. This method improves heat dissipation efficiency.

Abstract: A light emitting diode devic that includes (a) a light emitting diode section, (b) an electrically conductive pad section being disposed outside the light emitting diode section and being electrically connected to an external power source, and (c) at least one electrically conductive interconnection section for connecting the electrically conductive pad section to one side or both sides of the light emitting diode section. In the light emitting diode device, a wire is connected to the electrically conductive pad section disposed outside the light emitting diode section, and the electrically conductive pad section is connected to one side of the light emitting diode section by means of at least one electrically conductive interconnection section, so that not only it is easy to uniformly coat a fluorescent substance, but also an area covering vertically emitted light can be reduced to enhance a light extraction efficiency of the light emitting diode device.