Abstract: Provided is an equipment front end module which can effectively control internal humidity by efficiently circulating an inert gas. The equipment front end module comprises: a module chamber; a side storage installed on a first surface of the module chamber and capable of storing a plurality of substrates therein; an inert gas supplier configured to supply an inert gas into the module chamber; a first exhaust line configured to connect the side storage and an exhaust device; and a flow rate controller installed in the first exhaust line.

Abstract: A plasma processing apparatus using a magnetic field includes a reaction chamber, a plasma generating device connected to the reaction chamber to generate plasma in the reaction chamber, a substrate support disposed in a lower portion in the reaction chamber to support a wafer to be etched by the plasma, and a magnetic module including a permanent magnet and an electromagnet disposed vertically above the reaction chamber and a DC power supply unit connected to the electromagnet to input power to the electromagnet.

Abstract: The transporting apparatus of the present invention comprises an end effector including a hand and a plurality of vacuum holes installed in the hand; and a carrier located on the hand and for supporting a consumable part, wherein the carrier comprises one side for supporting a consumable part, the other surface facing the hand of the end effector, and a plurality of support blocks installed on the other surface and corresponding to the plurality of vacuum holes, wherein an inner space communicating with the vacuum hole is installed in the plurality of support blocks, and the inner space is evacuated by negative pressure provided from the plurality of vacuum holes.

Abstract: A substrate transfer module, which provides clean environment to prevent particles from moving to a substrate, and semiconductor manufacturing equipment including the same. The substrate transfer module of the semiconductor manufacturing equipment includes a transfer chamber providing a transfer space of the substrate, having a chamber groove lowered by a predetermined height from a bottom surface to form a gap with respect to the bottom surface, a guide member provided in an inside portion of the transfer chamber, and a substrate transfer robot configured to move along the guide member and to transfer the substrate.

Abstract: Provided are a substrate transporting apparatus capable of preventing an increase in temperature of a transporting robot by installing a cooling plate around the transporting robot, and a substrate treating system including the same. The substrate transporting apparatus includes a transporting unit for transporting a substrate; and a cooling plate for controlling a temperature of the transporting unit, wherein the cooling plate is spaced apart from a side surface of the transporting unit and installed as a side wall, or is installed in close contact with the side surface of the transporting unit.

Abstract: Provided are a substrate storage apparatus and a substrate processing apparatus using the substrate storage apparatus. The substrate storage apparatus includes a housing having a loading/unloading port for loading/unloading of a substrate and configured to provide a loading space for a loaded substrate, a separation membrane coupled to the housing to divide the loading space into a plurality of separation spaces isolated from each other, a gas supplier configured to supply a purge gas into the loading space to clean the substrate, a gas discharger configured to discharge the purge gas accommodated in the loading space, and a controller configured to control supply and discharge of the purge gas for each of the plurality of separation spaces.

Abstract: Provided are a substrate transporting apparatus capable of preventing an increase in temperature of a transporting robot by installing a cooling plate around the transporting robot, and a substrate treating system including the same. The substrate transporting apparatus includes a transporting unit for transporting a substrate; and a cooling plate for controlling a temperature of the transporting unit, wherein the cooling plate is spaced apart from a side surface of the transporting unit and installed as a side wall, or is installed in close contact with the side surface of the transporting unit.

Abstract: A substrate treating apparatus is provided. The substrate treating apparatus includes an atmospheric pressure transfer module provided with a first transfer robot having a first hand with a substrate placed thereon; a vacuum transfer module provided with a second transfer robot having a second hand with a substrate placed thereon; a load-lock chamber positioned between the atmospheric pressure transfer module and the vacuum transfer module, and having an inner space convertible between an atmospheric pressure and a vacuum atmosphere; a process chamber coupled to the vacuum transfer module and treating the substrate; and a ring carrier supported by the first transfer robot or the second transfer robot for a transfer of a ring member. The ring carrier comprises a plate having the ring member placed thereon and at least one leg protruding from a bottom surface of the plate and placed at the first hand or the second hand.

Abstract: A substrate treatment apparatus includes a transport part to transport a transparent rectangular substrate, a substrate support part to support the substrate, light generators to irradiate two different lights onto the moving substrate, and sense the irradiated lights, and a controller to determine a posture of the substrate with reference to the sensed lights and control the transport part such that the substrate is seated on the substrate support part in a default posture that is preset. The controller determines the posture of the transparent rectangular substrate with respect to the default posture using a time difference between a time point at which a first light of the two different lights is not transmitted through an edge of the transparent rectangular substrate and a time point at which a second light of the two different lights is not transmitted through the edge of the transparent rectangular substrate.

Abstract: Disclosed is a ring carrier used for transferring a ring member. The ring carrier includes a body having a plate shape, and a guide part protruding from an upper surface of the body to face an inner periphery of the ring member, and an alignment hole used when the ring carrier is aligned is formed in the body to pass through the body.

Abstract: Disclosed is a substrate treating apparatus. The substrate treating apparatus includes a load lock chamber, of which a pressure of an interior space is changed between a first pressure and a second pressure that is lower than the first pressure, an index chamber connected to the load lock chamber, and a measurement unit that measures a level of particles in the interior space, and the measurement unit is located outside the load lock chamber.

Abstract: An apparatus for treating a substrate includes a process chamber that treats the substrate, a buffer module that accommodates a ring member to be transported into the process chamber, and a load-lock chamber having an inner space. The buffer module includes a buffer chamber having a buffer space in which the ring member is accommodated, a support shelf that supports the ring member in the buffer space, and a drive member that moves the support shelf.

Abstract: A substrate treatment apparatus includes a transport part to transport a transparent rectangular substrate, a substrate support part to support the substrate, light generators to irradiate two different lights onto the moving substrate, and sense the irradiated lights, and a controller to determine a posture of the substrate with reference to the sensed lights and control the transport part such that the substrate is seated on the substrate support part in a default posture that is preset. The controller determines the posture of the transparent rectangular substrate with respect to the default posture using a time difference between a time point at which a first light of the two different lights is not transmitted through an edge of the transparent rectangular substrate and a time point at which a second light of the two different lights is not transmitted through the edge of the transparent rectangular substrate.

Abstract: Provided are a substrate transporting apparatus capable of preventing an increase in temperature of a transporting robot by installing a cooling plate around the transporting robot, and a substrate treating system including the same. The substrate transporting apparatus includes a transporting unit for transporting a substrate; and a cooling plate for controlling a temperature of the transporting unit, wherein the cooling plate is spaced apart from a side surface of the transporting unit and installed as a side wall, or is installed in close contact with the side surface of the transporting unit.

Abstract: A substrate treatment apparatus includes a transport part to transport a transparent rectangular substrate, a substrate support part to support the substrate, light generators to irradiate two different lights onto the moving substrate, and sense the irradiated lights, and a control device to determine a posture of the substrate with reference to the sensed lights and control the transport part such that the substrate is seated on the substrate support part in a default posture that is preset. The control device determines the posture of the transparent rectangular substrate with respect to the default posture using a time difference between a time point at which a first light of the two different lights is not transmitted through an edge of the transparent rectangular substrate and a time point at which a second light of the two different lights is not transmitted through the edge of the transparent rectangular substrate.

Abstract: Provided are a focus ring height adjusting device motor configured to compensate for an inclination of a focus ring using a lift pin vertically operated by a motor and a wafer etching apparatus including the same. The focus ring height adjusting device includes the focus ring, a first lift pin configured to move upward at one side of the focus ring height adjusting device to come into contact with the focus ring, and a second lift pin configured to move upward at the other side of the focus ring height adjusting device to come into contact with the focus ring, wherein the first lift pin and the second lift pin move upward until both of the first lift pin and the second lift pin come into contact with the focus ring to compensate for an inclination of the focus ring.

Abstract: Provided are a substrate storage apparatus and a substrate processing apparatus using the substrate storage apparatus. The substrate storage apparatus includes a housing having a loading/unloading port for loading/unloading of a substrate and configured to provide a loading space for a loaded substrate, a separation membrane coupled to the housing to divide the loading space into a plurality of separation spaces isolated from each other, a gas supplier configured to supply a purge gas into the loading space to clean the substrate, a gas discharger configured to discharge the purge gas accommodated in the loading space, and a controller configured to control supply and discharge of the purge gas for each of the plurality of separation spaces.

Abstract: Disclosed are an apparatus for treating a substrate and a plasma generating device. The apparatus for treating a substrate includes a process chamber, a support unit supporting the substrate in the process chamber, a gas supply unit supplying a process gas in the process chamber, and a plasma generating unit generating a plasma from the process gas supplied in the process chamber, and the plasma generating unit includes a high frequency power supply, an antenna unit connected to the high frequency power via a supply line, and an impedance matcher connected between the high frequency power supply and the antenna unit via the supply line and matching impedance, and the impedance matcher includes a first sensor connected to an input terminal and measuring input impedance and a second sensor connected to an output terminal and measuring output impedance.

Abstract: Provided are a substrate supporting unit and a single type substrate polishing apparatus using the substrate supporting unit. During a polishing process, the bottom surface of a substrate is attached to the substrate supporting unit by vacuum suction, and during a post-cleaning process, the substrate is supported by the substrate supporting unit at a position spaced apart from the substrate supporting unit for cleaning the bottom surface of the substrate. Therefore, according to the substrate supporting unit and the substrate polishing apparatus using the substrate supporting unit, in a state where the substrate is supported by the single type substrate supporting unit, a process for polishing the top surface of the substrate and a post-process for cleaning the top and bottom surfaces of the substrate can be sequentially performed.

Abstract: Provided are a substrate supporting unit and a single type substrate polishing apparatus using the substrate supporting unit. During a polishing process, the bottom surface of a substrate is attached to the substrate supporting unit by vacuum suction, and during a post-cleaning process, the substrate is supported by the substrate supporting unit at a position spaced apart from the substrate supporting unit for cleaning the bottom surface of the substrate. Therefore, according to the substrate supporting unit and the substrate polishing apparatus using the substrate supporting unit, in a state where the substrate is supported by the single type substrate supporting unit, a process for polishing the top surface of the substrate and a post-process for cleaning the top and bottom surfaces of the substrate can be sequentially performed.