Patents by Inventor Duk-Kyu KIM

Duk-Kyu KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240136674
    Abstract: Disclosed is an electrode assembly, a battery, and a battery pack and a vehicle including the same. In the electrode assembly, a first electrode, a second electrode, and a separator interposed therebetween are wound based on a winding axis to define a core and an outer circumference. The first electrode includes a first active material portion coated with an active material layer and a first uncoated portion not coated with an active material layer along a winding direction. At least a part of the first uncoated portion is defined as an electrode tab by itself. The first uncoated portion includes a first portion adjacent to the core of the electrode assembly, a second portion adjacent to the outer circumference of the electrode assembly, and a third portion interposed between the first portion and the second portion. The first portion or the second portion has a smaller height than the third portion in the winding axis direction.
    Type: Application
    Filed: January 19, 2022
    Publication date: April 25, 2024
    Applicant: LG ENERGY SOLUTION, LTD.
    Inventors: Jong-Sik PARK, Jae-Won LIM, Yu-Sung CHOE, Hak-Kyun KIM, Je-Jun LEE, Byoung-Gu LEE, Duk-Hyun RYU, Kwan-Hee LEE, Jae-Eun LEE, Pil-Kyu PARK, Kwang-Su HWANGBO, Do-Gyun KIM, Geon-Woo MIN, Hae-Jin LIM, Min-Ki JO, Su-Ji CHOI, Bo-Hyun KANG, Jae-Woong KIM, Ji-Min JUNG, Jin-Hak KONG, Soon-O LEE, Kyu-Hyun CHOI
  • Patent number: 11950374
    Abstract: An apparatus that communicates with a screen printer and a solder inspection device is disclosed. The apparatus according to the present disclosure may include a process that is configured to: obtain first information associated with each of a plurality of pads on the substrate; obtain second information associated with each piece of the solder paste applied to each of the plurality of pads from the solder inspection device; determine a position correction value for the stencil mask with respect to the substrate based on the first information and the second information; and deliver the position correction value to the screen printer.
    Type: Grant
    Filed: October 28, 2021
    Date of Patent: April 2, 2024
    Assignee: KOH YOUNG TECHNOLOGY INC.
    Inventors: Duk Young Lee, Jae Hyung Kim, Jeong Kyu Noh
  • Publication number: 20170111728
    Abstract: Disclosed are a bone conduction speaker module and bone conduction earphones having the bone conduction speaker modules. More particularly, the present invention relates to a bone conduction speaker module and bone conduction earphones having the bone conduction speaker modules, wherein the bone conduction speaker modules can accurately output sound, can stably output sound with fewer vibrations, enable a wearer to comfortably use the earphones, can prevent strain to the wearer by minimizing influence of magnetic force, can facilitate wearing of the earphones, and can prevent an accident from occurring by allowing the wearer to hear external sounds. To this end, a bone conduction speaker module used in earphones, headphones, and a hearing aid, includes: a housing including a first casing covering a portion coming into contact with a human body and a second casing covering a side of the first casing; a magnet part; and a voice coil part.
    Type: Application
    Filed: July 1, 2015
    Publication date: April 20, 2017
    Applicant: DAESUNG M-TECH CO., LTD.
    Inventors: Duk-Kyu KIM, Seok-Kyu KANG, Nam-Sik CHOI, Sang-Kyu KANG, Sung-Heum BAEK, Joo-Hoon SEONG, ill-sun KANG