Patents by Inventor Duk Yong Yoon

Duk Yong Yoon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11890091
    Abstract: The present disclosure relates to a method for providing whether a patient is accompanied by a caregiver and a device using the same, the method for providing whether the patient is accompanied by the caregiver being configured to be implemented by a processor and including receiving an outpatient clinic record from a user device, tokenizing each sentence of the outpatient clinic record as a unit of at least one token, encoding the tokenized outpatient clinic record as an integer, and determining whether a psychiatric symptom occurs for a patient related to the outpatient clinic record by inputting the encoded outpatient clinic record by using a determination model that uses the encoded outpatient clinic record as an input and uses whether the psychiatric symptom occurs as an output.
    Type: Grant
    Filed: August 29, 2023
    Date of Patent: February 6, 2024
    Assignees: INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITY, PEOPLE & TECHNOLOGY INC.
    Inventors: Jin Young Park, Duk Yong Yoon, Soo Jeong Kim, Dong Won Kim, Ji Hoon Seo, Woo Chul Jung
  • Patent number: 5843371
    Abstract: A lead-free soldering material for soldering wires of electronic parts is disclosed. The lead-free soldering material is composed of in weight %: 3-4% of Ag, 2-5% of In, 6-14% of Bi and a balance of Sn, and the soldering material shows a superior solderability.
    Type: Grant
    Filed: October 11, 1995
    Date of Patent: December 1, 1998
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Choong Sik Yoo, Mi Yeon Kim, Duk Yong Yoon
  • Patent number: 5306364
    Abstract: A tungsten based heavy alloy having a W--Ni--Fe based composition containing traces of lanthanum or calcium, thereby capable of exhibiting high toughness, irrespective of the content of impurities such as phosphorous and sulfur contained therein, the cooling rate after the sintering treatment and the re-heating treatment. The present invention provides a method for making the high toughness tungsten based heavy alloy. The tungsten based heavy alloy of the present invention is useful to manufacture warheads for breaking armor plates, which require high toughness.
    Type: Grant
    Filed: June 9, 1992
    Date of Patent: April 26, 1994
    Assignee: Agency For Defense Development
    Inventors: Seong-Hyeon Hong, Suk-Joong L. Kang, Duk Yong Yoon, Woon-Hyung Baek