Patents by Inventor Dukman Kim

Dukman Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chip package and manufacturing method thereof
    Patent number: 8110902
    Abstract: A chip package including at least a shielding layer for better electromagnetic interferences shielding is provided. The shielding layer disposed over the top surface of the laminate substrate can protect the chip package from the underneath EMI radiation. The chip package may further include another shielding layer over the molding compound of the chip package.
    Type: Grant
    Filed: February 19, 2009
    Date of Patent: February 7, 2012
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Younghyo Eun, Dukman Kim
  • CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
    Publication number: 20100207258
    Abstract: A chip package including at least a shielding layer for better electromagnetic interferences shielding is provided. The shielding layer disposed over the top surface of the laminate substrate can protect the chip package from the underneath EMI radiation. The chip package may further include another shielding layer over the molding compound of the chip package.
    Type: Application
    Filed: February 19, 2009
    Publication date: August 19, 2010
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Younghyo Eun, Dukman Kim