Abstract: The embodiments of the present disclosure disclose a scroll type micro-compressor, and a method for machining a fixed scroll plate and an orbit scroll plate thereof. The scroll type micro-compressor comprises a fixed scroll plate and an orbit scroll plate each integrally made with a monocrystalline silicon substrate; the compressor device has an Oldham ring structure, and reduces a mass of the orbit scroll plate by optimizing a design of a substrate of the orbit scroll plate; a cross-sectional shape of a plurality of micropores provided on a lower surface of the fixed scroll plate is set as of a fan ring, in which an electrode material is accommodated to maintain an electric field uniformity and reduce an electric field loss; and hydrophilia of inner surfaces is changed to prevent a top leakage and facilitate capillary filling of a compression chamber.

Abstract: The embodiments of the present disclosure disclose a scroll type micro-compressor, and a method for machining a fixed scroll plate and an orbit scroll plate thereof. The scroll type micro-compressor comprises a fixed scroll plate and an orbit scroll plate each integrally made with a monocrystalline silicon substrate; the compressor device has an Oldham ring structure, and reduces a mass of the orbit scroll plate by optimizing a design of a substrate of the orbit scroll plate; a cross-sectional shape of a plurality of micropores provided on a lower surface of the fixed scroll plate is set as of a fan ring, in which an electrode material is accommodated to maintain an electric field uniformity and reduce an electric field loss; and hydrophilia of inner surfaces is changed to prevent a top leakage and facilitate capillary filling of a compression chamber.

Abstract: A capacitive accelerometer having one or more micromachined acceleration sensor assembly is disclosed. The acceleration sensor assembly comprises a spring-mass-support structure, a top cap and a bottom cap. The proof mass plate of the spring-mass-support structure has cutout spaces and is supported by a pair of branched torsional beams which are substantially located in the cutout spaces. The torsional axis of the proof mass plate is offset from the mass center in direction perpendicular to the proof mass plate. The acceleration sensor assembly further comprises multiple coplanar electrodes for differential capacitive sensing and electrostatic forcing. The capacitive accelerometer according to the present invention may comprise one, two or six micromachined acceleration sensor assemblies with electronic signal detection, conditioning and control circuits in different configurations and applications to detect and measure linear and angular accelerations.

Abstract: A capacitive accelerometer having one or more micromachined acceleration sensor assembly is disclosed. The acceleration sensor assembly comprises a spring-mass-support structure, a top cap and a bottom cap. The proof mass plate of the spring-mass-support structure has cutout spaces and is supported by a pair of branched torsional beams which are substantially located in the cutout spaces. The torsional axis of the proof mass plate is offset from the mass center in direction perpendicular to the proof mass plate. The acceleration sensor assembly further comprises multiple coplanar electrodes for differential capacitive sensing and electrostatic forcing. The capacitive accelerometer according to the present invention may comprise one, two or six micromachined acceleration sensor assemblies with electronic signal detection, conditioning and control circuits in different configurations and applications to detect and measure linear and angular accelerations.

Abstract: An accelerometer (305) for measuring seismic data. The accelerometer (305) includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer (305) also includes a top cap press frame recess (405) and a bottom cap press frame recess (420) for isolating bonding pressures to specified regions of the accelerometer (305). The accelerometer (305) is vacuum-sealed and includes a balanced metal pattern (730) to prevent degradation of the performance of the accelerometer (305). A dicing process is performed on the accelerometer (305) to isolate the electrical leads of the accelerometer (305). The accelerometer (305) further includes overshock protection bumpers (720) and patterned metal electrodes to reduce stiction during the operation of the accelerometer (305).

Abstract: The present invention provides a digital optical switch apparatus and process for manufacturing the apparatus. The apparatus includes a mirror assembly coupled to a top cap and to a bottom cap. The top and bottom caps each include one or more electrodes that, when energized with electrical energy, move a mirrored surface to one of a plurality of discrete positions. Mirror assemblies can be cascaded to create a packaged assembly having any multiple of discrete positions. The process includes planar micro-machining techniques to create isolated islands for electrical feed through. The process enables mechanical bonding of multiple tiers via a single bond region and through a bond-pad window.

Abstract: A sensor apparatus (104) includes a plural different spatial direction axis of sensitivity positioned sensor package containing sensor module (305) supported by a planar surface (345) within a cavity (340) of a housing (205) coupled to a first end cap (210) by a PC-board connection (355). Housing (205) is further coupled to first end cap (210) by a first coupling member (315) and a second coupling member (320) and is also coupled to an opposite second end cap (215) by a third coupling member (320) and a fourth coupling member (325). Interface sealing members (330a, 330b, 330c, 330d) seal between housing (205) and first end cap (210). Interface sealing members (335a, 335b, 335c, 335d) seal between housing (205) and second end cap (215).

Abstract: An accelerometer (305) for measuring seismic data. The accelerometer (305) includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer (305) also includes a top cap press frame recess (405) and a bottom cap press frame recess (420) for isolating bonding pressures to specified regions of the accelerometer (305). The accelerometer (305) is vacuum-sealed and includes a balanced metal pattern (730) to prevent degradation of the performance of the accelerometer (305). A dicing process is performed on the accelerometer (305) to isolate the electrical leads of the accelerometer (305). The accelerometer (305) further includes overshock protection bumpers (720) and patterned metal electrodes to reduce stiction during the operation of the accelerometer (305).

Abstract: An accelerometer (305) for measuring seismic data. The accelerometer (305) includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer (305) also includes a top cap press frame recess (405) and a bottom cap press frame recess (420) for isolating bonding pressures to specified regions of the accelerometer (305). The accelerometer (305) is vacuum-sealed and includes a balanced metal pattern (730) to prevent degradation of the performance of the accelerometer (305). A dicing process is performed on the accelerometer (305) to isolate the electrical leads of the accelerometer (305). The accelerometer (305) further includes overshock protection bumpers (720) and patterned metal electrodes to reduce stiction during the operation of the accelerometer (305).

Abstract: An accelerometer (305) for measuring seismic data. The accelerometer (305) includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer (305) also includes a top cap press frame recess (405) and a bottom cap press frame recess (420) for isolating bonding pressures to specified regions of the accelerometer (305). The accelerometer (305) is vacuum-sealed and includes a balanced metal pattern (730) to prevent degradation of the performance of the accelerometer (305). A dicing process is performed on the accelerometer (305) to isolate the electrical leads of the accelerometer (305). The accelerometer (305) further includes overshock protection bumpers (720) and patterned metal electrodes to reduce stiction during the operation of the accelerometer (305).

Abstract: A system for resiliently attaching a mass to a package. The system includes a mass, a housing, resilient couplings for resiliently attaching the mass to the housing, bumpers for slidingly supporting the mass, and electrical connections for electrically coupling the mass to the housing.

Abstract: An accelerometer (305) for measuring seismic data. The accelerometer (305) includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer (305) also includes a top cap press frame recess (405) and a bottom cap press frame recess (420) for isolating bonding pressures to specified regions of the accelerometer (305). The accelerometer (305) is vacuum-sealed and includes a balanced metal pattern (730) to prevent degradation of the performance of the accelerometer (305). A dicing process is performed on the accelerometer (305) to isolate the electrical leads of the accelerometer (305). The accelerometer (305) further includes overshock protection bumpers (720) and patterned metal electrodes to reduce stiction during the operation of the accelerometer (305).

Abstract: Disclosed is an accelerometer for measuring seismic data. The accelerometer includes a proof mass that is resiliently coupled to a support structure by folded beams, S-shaped balanced beams, straight beams, and/or folded beams with resonance damping. The support structure further includes travel stops for limiting transverse motion of the proof mass.

Abstract: Disclosed is an accelerometer for measuring seismic data. The accelerometer includes a proof mass that is resiliently coupled to a support structure by folded beams, S-shaped balanced beams, straight beams, and/or folded beams with resonance damping. The support structure further includes travel stops for limiting transverse motion of the proof mass.

Abstract: A merged-mask micro-machining process is provided that includes the application of a plurality of layers of masking material that are patterned to provide a plurality of etching masks.

Abstract: The present invention provides a digital optical switch apparatus and process for manufacturing the apparatus. The apparatus includes a mirror assembly coupled to a top cap and to a bottom cap. The top and bottom caps each include one or more electrodes that, when energized with electrical energy, move a mirrored surface to one of a plurality of discrete positions. Mirror assemblies can be cascaded to create a packaged assembly having any multiple of discrete positions. The process includes planar micro-machining techniques to create isolated islands for electrical feed through. The process enables mechanical bonding of multiple tiers via a single bond region and through a bond-pad window.

Abstract: Disclosed is an accelerometer for measuring seismic data. The accelerometer includes a proof mass that is resiliently coupled to a support structure by folded beams, S-shaped balanced beams, straight beams, and/or folded beams with resonance damping. The support structure further includes travel stops for limiting transverse motion of the proof mass.

Abstract: A micro machined structure includes one or more temporary bridges for temporarily coupling the micro machined structure to a support structure.

Abstract: A micro machined mirror assembly is provided that includes a micro machined top cap, mirror, and bottom cap mounted onto a ceramic substrate. The micro machined mirror is resiliently supported by a pair of T-shaped hinges. At least two electrostatic force application pads are disposed to rotate the mirror about a primary axis and about a secondary axis.

Abstract: A micro machined mirror assembly is provided that includes a micro machined top cap, mirror, and bottom cap mounted onto a ceramic substrate. The micro machined mirror is resiliently supported by a pair of T-shaped hinges. At least two electrostatic force application pads are disposed to rotate the mirror about a primary axis and about a secondary axis.