Patents by Inventor Dun-Hao Yang

Dun-Hao Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat dissipation module and electronic device having the same
    Patent number: 12007816
    Abstract: A heat dissipation module is adapted for a circuit board, which has an M.2 bonding hole. The heat dissipation module includes a supporting bracket and a heat dissipation element. The supporting bracket has a first side and a second side opposite to each other, and an accommodating space, which is located between the first side and the second side, and is adapted for installing an SSD interface card. The first side has a first mounting hole and a second mounting hole. The heat dissipation element is combined to the first side through the first mounting hole. When the SSD interface card is installed in the accommodating space, the SSD interface card and the supporting bracket are combined to the M.2 bonding hole through the second mounting hole so that the second side faces the circuit board.
    Type: Grant
    Filed: June 29, 2022
    Date of Patent: June 11, 2024
    Assignee: ASUSTeK COMPUTER INC.
    Inventors: Dun-Hao Yang, Kuang-Yu Chang, Ming-Fang Tsai
  • HEAT DISSIPATION MODULE AND ELECTRONIC DEVICE HAVING THE SAME
    Publication number: 20230205284
    Abstract: A heat dissipation module is adapted for a circuit board, which has an M.2 bonding hole. The heat dissipation module includes a supporting bracket and a heat dissipation element. The supporting bracket has a first side and a second side opposite to each other, and an accommodating space, which is located between the first side and the second side, and is adapted for installing an SSD interface card. The first side has a first mounting hole and a second mounting hole. The heat dissipation element is combined to the first side through the first mounting hole. When the SSD interface card is installed in the accommodating space, the SSD interface card and the supporting bracket are combined to the M.2 bonding hole through the second mounting hole so that the second side faces the circuit board.
    Type: Application
    Filed: June 29, 2022
    Publication date: June 29, 2023
    Applicant: ASUSTeK COMPUTER INC.
    Inventors: Dun-Hao Yang, Kuang-Yu Chang, Ming-Fang Tsai