Abstract: A method of manufacturing Ce:YAG polycrystalline phosphor with the formula (Y1-x-mAxCem)3(Al1-yBy)5O12; 0?x?1, 0?y?1, 0?m?0.05; wherein A is one of Lu, Tb, Pr, La and Gd; and wherein B is one of Ga, Ti, Mn, Cr and Zr.

Abstract: The present invention relates to a novel white light LED packaging structure and a process for manufacturing the same. An anti-blue light reflection film(s) is deposited on one surface of a fluorescent wafer, wherein the surface is attached to a blue-emitting chip. The anti-blue light reflection film(s) on the wafer can effectively prevent the incident blue light from reflecting on the surface of the wafer, increase the availability of the blue light and reduce the reflection loss of yellowish green light in the direction towards the chip, and thereby improving the whole luminous efficacy of the device. The white light LED packaging structure of the present invention has high fluorescence efficiency, and is suitable for applying in high-power white light LED illumination field.

Abstract: The present invention relates to a white light LED lamp and a filament. The white light LED filament comprises light emitting units and a strip-shaped fluorescent wafer(s) at least positioned at one side of the light emitting units, wherein the light emitting units are blue-emitting chips connected by a metal wire or an electric conductive circuit, and wherein electrodes are arranged at the end(s) of the fluorescent wafer. Without any lens, the filament of the present invention has a simple structure. A white light LED lamp using the filament realizes a 360° stereo-luminescence, and shows the advantages of low cost, excellent heat radiation, high luminous efficacy and so on.

Abstract: The present invention relates to a Ce:YAG wafer-based composite structure comprising a Ce:YAG wafer and a red light emitting layer fixed on the Ce:YAG wafer. The present invention also relates to a method for the preparation of the Ce:YAG wafer-based composite structure. The optical composite structure realizes a wide waveband luminescence from green light to red light, and can be widely used in the fields of detection equipment and illumination devices.

Abstract: An LED integrated packaging structure is disclosed including a base; at least one LED chip which is fixedly connected on the base, the LED chip having positive and negative electrodes; an insulation layer which is disposed on surfaces of the base and the LED chip and the, wherein surfaces of the positive and negative electrodes of the LED chip are exposed from the insulation layer; at least two connecting electrodes which are disposed on the base and the LED chip.