Patents by Inventor Dun-Wei SU

Dun-Wei SU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device and electrically-conducting assembly thereof
    Patent number: 9226434
    Abstract: An electrically-conducting assembly for conducting a first housing and a second housing of an electronic device. The first housing is detachably combined with the second housing. The electrically-conducting assembly includes a retaining wall and a lapping part. The retaining wall is perpendicularly provided at the first housing, and a surface of the retaining wall has an electrically-conducting layer. The lapping part is perpendicularly provided at the second housing, and a surface of the lapping part has another electrically-conducting layer. The lapping part and the retaining wall contact with each other when the first housing and the second housing are combined so that the electrically-conducting layer and the another electrically-conducting layer are mutually conductive.
    Type: Grant
    Filed: September 6, 2013
    Date of Patent: December 29, 2015
    Assignee: PEGATRON CORPORATION
    Inventors: Su-Tai Huang, Dun-Wei Su
  • ELECTRONIC DEVICE AND ELECTRICALLY-CONDUCTING ASSEMBLY THEREOF
    Publication number: 20140111918
    Abstract: An electrically-conducting assembly for conducting a first housing and a second housing of an electronic device. The first housing is detachably combined with the second housing. The electrically-conducting assembly includes a retaining wall and a lapping part. The retaining wall is perpendicularly provided at the first housing, and a surface of the retaining wall has an electrically-conducting layer. The lapping part is perpendicularly provided at the second housing, and a surface of the lapping part has another electrically-conducting layer. The lapping part and the retaining wall contact With each other when the first housing and the second housing are combined so that the electrically-conducting layer and the another electrically-conducting layer are mutually conductive.
    Type: Application
    Filed: September 6, 2013
    Publication date: April 24, 2014
    Applicant: PEGATRON CORPORATION
    Inventors: Su-Tai HUANG, Dun-Wei SU