Abstract: A 3-D multi-wafer stacked semiconductor structure and method for manufacturing the same. The method comprises steps of: providing a first wafer, a first circuit layer being formed on a surface thereof; bonding the first circuit layer with a carrier; performing a first thinning process on the first wafer; forming a first mask on the other surface of the thinned first wafer; providing a second wafer, a second circuit layer being formed on a surface thereof; bonding the second circuit layer with the first mask; and forming at least a through via filled with a conductor to electrically connect a first connecting pad on the first circuit layer and a second connecting pad on the second circuit layer.

Abstract: A transparent wafer with optical alignment function is provided. The transparent wafer includes a transparent substrate with an alignment feature on the edge and an opaque layer at least disposed along the peripheral area on the surface of the transparent substrate. The opaque layer can absorb or reflect the detecting light, thus the transparent wafer can be aligned by detecting the alignment feature. The present invention also includes the fabricating method and alignment method of the transparent wafer with optical alignment function.