Abstract: In one embodiment, a semiconductor test control system includes a computer system having a plurality of hardware resources; a hypervisor installed on the computer system; and a test floor controller installed on the computer system. The hypervisor virtualizes the hardware resources and provides each of at least one virtual appliance with access to a respective virtual set of hardware resources. Each virtual set of hardware resources places its respective virtual appliance in controlling communication with at least a first aspect of a semiconductor test system, thereby enabling the respective virtual appliance to test a respective type of semiconductor device. The test floor controller is in controlling communication with i) at least a second aspect of the semiconductor test system, and ii) each of the at least one virtual appliance.

Abstract: In one embodiment, a semiconductor test control system includes a computer system having a plurality of hardware resources; a hypervisor installed on the computer system; and a test floor controller installed on the computer system. The hypervisor virtualizes the hardware resources and provides each of at least one virtual appliance with access to a respective virtual set of the hardware resources. Each virtual set of the hardware resources places its respective virtual appliance in controlling communication with at least a first aspect of a semiconductor test system, thereby enabling the respective virtual appliance to test a respective type of semiconductor device. The test floor controller is in controlling communication with i) at least a second aspect of the semiconductor test system, and ii) each of the at least one virtual appliance.

Abstract: In one embodiment, a semiconductor test control system includes a computer system having a plurality of hardware resources; a hypervisor installed on the computer system; and a test floor controller installed on the computer system. The hypervisor virtualizes the hardware resources and provides each of at least one virtual appliance with access to a respective virtual set of hardware resources. Each virtual set of hardware resources places its respective virtual appliance in controlling communication with at least a first aspect of a semiconductor test system, thereby enabling the respective virtual appliance to test a respective type of semiconductor device. The test floor controller is in controlling communication with i) at least a second aspect of the semiconductor test system, and ii) each of the at least one virtual appliance.

Abstract: In accordance with one embodiment of the invention, a method and apparatus are provided for testing a wafer while the wafer is disposed in a wafer carrier. The test results can be utilized to adjust the manufacturing process and thereby increase processing yield.

Abstract: In one embodiment, a semiconductor test control system includes a computer system having a plurality of hardware resources; a hypervisor installed on the computer system; and a test floor controller installed on the computer system. The hypervisor virtualizes the hardware resources and provides each of at least one virtual appliance with access to a respective virtual set of the hardware resources. Each virtual set of the hardware resources places its respective virtual appliance in controlling communication with at least a first aspect of a semiconductor test system, thereby enabling the respective virtual appliance to test a respective type of semiconductor device. The test floor controller is in controlling communication with i) at least a second aspect of the semiconductor test system, and ii) each of the at least one virtual appliance.

Abstract: A testing device may include a memory controller managing a transfer of data; and a plurality of interface boards. Each interface board includes a controller buffer. Each controller buffer transfers data between the memory controller and at least one memory module. The memory controller tests the at least one memory module. The testing device is operable to test the at least one memory module independent of an operating rate of the at least one memory module. The memory controller receives operating data of the at least one memory module.

Abstract: In accordance with one embodiment of the invention, a method and apparatus are provided for testing a wafer while the wafer is disposed in a wafer carrier. The test results can be utilized to adjust the manufacturing process and thereby increase processing yield.

Abstract: A testing device may include a memory controller managing a transfer of data; and a plurality of interface boards. Each interface board includes a controller buffer. Each controller buffer transfers data between the memory controller and at least one memory module. The memory controller tests the at least one memory module. The testing device is operable to test the at least one memory module independent of an operating rate of the at least one memory module. The memory controller receives operating data of the at least one memory module.

Abstract: Described are an electronic testing device for memory devices and related methods. The testing device, comprises a memory controller managing a transfer of data and a controller buffer disposed within the memory controller. The controller buffer transfers data between the memory controller and a memory module. The memory controller tests the memory module. The testing device is operable to test the memory module independent of an operating rate of the memory module. The memory controller receives operating data of the memory module.

Abstract: A wafer test head and ATE for testing semiconductor wafers. The wafer test head having a plurality of sides that can each be used to test a different semiconductor wafer. The architecture of the wafer test head enables electrical connections to probe card located on two different sides of the wafer test head. Multiple silicon wafers can be tested for proper functionality at the same time or in an interleaved fashion via a single multi-sided wafer test head. The internal architecture of an exemplary wafer test head allows printed circuit cards to be able to electrically connected to multiple wafer test locations on a single wafer test head.

Abstract: A wafer test head and ATE for testing semiconductor wafers. The wafer test head having a plurality of sides that can each be used to test a different semiconductor wafer. The architecture of the wafer test head enables electrical connections to probe card located on two different sides of the wafer test head. Multiple silicon wafers can be tested for proper functionality at the same time or in an interleaved fashion via a single multi-sided wafer test head. The internal architecture of an exemplary wafer test head allows printed circuit cards to be able to electrically connected to multiple wafer test locations on a single wafer test head.

Abstract: An improved clocked data converter with a vibrating microelectromechanical systems (MEMS) resonator. The MEMS resonator is used as part of the clock circuitry of an analog to digital converter or a digital to analog converter. The MEMS resonator may be used as the frequency determining element of an on-chip oscillator, or as a bandpass filter used to clean up an external clock signal.

Abstract: An improved clocked data converter with a vibrating microelectromechanical systems (MEMS) resonator. The MEMS resonator is used as part of the clock circuitry of an analog to digital converter or a digital to analog converter. The MEMS resonator may be used as the frequency determining element of an on-chip oscillator, or as a bandpass filter used to clean up an external clock signal.

Abstract: A mixed-signal integrated circuit testing device includes test electronics for generating a test signal for input to a device under test and receiving a response signal from the device under test, and an interface connected between the test electronics and the device under test. The interface includes at least one Micro Electro-Mechanical Systems (MEMS) filter for filtering an analog signal associated with one of the test signal and the response signal.