Abstract: An aqueous electrolytic plating solution and a method of using the same for depositing a cobalt/nickel/phosphorus alloy on an electrically conductive substrate are provided. The aqueous electrolytic plating solution comprises: a) a source of nickel ions; b) a source of cobalt ions; c) a source of phosphite ions; d) an amino acid; and e) optionally, boric acid. The deposited cobalt/nickel/phosphorus alloy exhibits high coercivity and high remanence.

Abstract: A method of extending the lifetime of an electroless nickel plating bath by avoiding the addition of unwanted anions to the process and of improving the pH stability of the bath and minimizing additions of pH correcting additives. The method includes the steps of (a) depositing electroless nickel from an electroless nickel plating bath onto a substrate, wherein the electroless nickel plating bath preferably contains a source of nickel ions and a source of hypophosphite ions; (2) immersing a nickel anode in the plating bath; (3) completing the circuit by utilizing a cathode separated from the nickel bath by an ion exchange membrane and using a catholyte comprising an acid or a salt thereof; and (4) passing a current through the bath. Nickel is dissolved into the plating bath to maintain the nickel concentration and hydrogen is discharged from the cathode.

Abstract: A method of extending the lifetime of an electroless nickel plating bath by avoiding the addition of unwanted anions to the process and of improving the pH stability of the bath and minimizing additions of pH correcting additives. The method includes the steps of (a) depositing electroless nickel from an electroless nickel plating bath onto a substrate, wherein the electroless nickel plating bath preferably contains a source of nickel ions and a source of hypophosphite ions; (2) immersing a nickel anode in the plating bath; (3) completing the circuit by utilizing a cathode separated from the nickel bath by an ion exchange membrane and using a catholyte comprising an acid or a salt thereof; and (4) passing a current through the bath. Nickel is dissolved into the plating bath to maintain the nickel concentration and hydrogen is discharged from the cathode.

Abstract: A process for electrolessly plating particulate matter is disclosed wherein the particulate and the electroless plating solution, without a reducing agent component, are combined with agitation in a plating vessel. If necessary, activator species are added directly to the plating solution. The reducing agent component is then added to the plating solution to initiate plating. Reliable plating upon the particulate, without instability of the plating solution, is achieved.