Patents by Inventor Dung T. Le

Dung T. Le has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140213548
    Abstract: The present invention relates a novel hemostatic wound dressing, preferably comprising chitosan and an oxygen carrier such as a perfluorocarbon, and methods to treat hemorrhaging wounds and MRSA infections. The present invention helps with coagulation/clot formation as well as providing oxygen to the wound, all while being cost effective and competitive with current hemostatic dressings.
    Type: Application
    Filed: January 27, 2014
    Publication date: July 31, 2014
    Applicant: New Jersey Institute of Technology
    Inventors: George J. Ulsh, Jennifer W. Moy, Maxwell A. McDermott, Dung T. Le, George Colling, Jessica Cardenas Turner
  • Patent number: 6536650
    Abstract: A self-grounding soldering tip having a spring which serves for connecting the soldering tip to a heater bobbin for establishing a secure grounding of the soldering tip. A bobbin tube extends within the heater bobbin for removably retaining the soldering tip within the bobbin. The connection between the spring and bobbin tube provide tip-to-ground continuity. Moreover, the contact surfaces of the spring and bobbin tube are wiped clean upon plug-in and plug-out. The spring and bobbin tube are located in a cooler area of the soldering iron to slow down the rate of oxidation. Also, the spring and bobbin tube are made of the same or compatible materials, e.g., stainless steel, to prevent reactions that normally occur between incompatible metals.
    Type: Grant
    Filed: October 11, 2001
    Date of Patent: March 25, 2003
    Assignee: Pace, Incorporated
    Inventors: Paul Alan Dunham, William Jordan Siegel, John Franklin Wood, Gary Silas Sines, Dung T. Le, David L. Gilbert, Jeffrey Alan Snell
  • Patent number: 6237831
    Abstract: A disposable solder receiving capsule for a hand held vacuum solder extracting desoldering tool is formed of an outer tube which is closed at one end by a porous filter and has an opening at its opposite end, and a hollow solder collection chamber part, having a tubular member with an open end and which is closed with respect to the passage of solder therethrough at an opposite end, forming a solder receiving space within it. The solder collection chamber part is concentrically positioned within the outer tube with an air plenum disposed between the closed end of the chamber part and the filter and with at least one air channel extending the length of solder collection part for providing a path for gases entering the open end of the outer tube to the plenum and the filter that is separated from the solder receiving space. For facilitating solder reclamation, the capsule can be formed entirely of materials which are shape-sustaining when exposed to a temperature of 400° F.
    Type: Grant
    Filed: February 22, 2000
    Date of Patent: May 29, 2001
    Assignee: Pace, Incorporated
    Inventors: David W. Lawrence, Dung T. Le, William Jordan Siegel, David Lee Gilbert
  • Patent number: 6186387
    Abstract: A disposable solder receiving capsule for a hand held vacuum solder extracting desoldering tool is formed of an outer tube which is closed at one end by a porous filter and is open at its opposite end, and a hollow solder collection chamber part having a tubular member with an open end and a closed end forming a solder receiving space within it. The solder collection chamber part is concentrically positioned within the outer tube with an air plenum disposed between the closed end of the chamber part and the filter and with at least one air channel extending the length of solder collection part for providing a path for gases entering the open end of the outer tube to the plenum and the filter that is separated from said solder receiving space. For facilitating solder reclamation, the capsule can be formed entirely of materials which are shape-sustaining when exposed to a temperature of 400° F.
    Type: Grant
    Filed: April 12, 1999
    Date of Patent: February 13, 2001
    Assignee: Pace Incorporated
    Inventors: David W. Lawrence, Dung T. Le