Patents by Inventor DUO CAO

DUO CAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240106282
    Abstract: A magnetically-isolated wireless charging assembly enabling temporary attachment by magnetism to a device requiring charge by induction includes a housing defining an accommodating space, a plurality of magnetic members disposed within the accommodating space, a wireless charging receiver covering the plurality of magnetic members, and a wireless charging receiver. The wireless charging receiver is disposed on a side of the magnetic shielding member facing the plurality of magnetic members and the magnetic shielding member prevents the magnetic field of the magnetic members extending through or beyond the shielding member.
    Type: Application
    Filed: December 19, 2022
    Publication date: March 28, 2024
    Inventors: BO-DUO YUAN, YAN-LEI CAO, HAO-XIANG LI
  • Patent number: 11605042
    Abstract: Interaction data sets of consumers of an offering set with an application associated with an offering set are obtained. At least some of the interactions are associated with respective content presentation operations. A neural network model is trained, using the interaction data sets, to generate predictions of actions of a consumer at whom a set of content presentation operations is directed, and to provide action-attribution scores for the content presentation operations. The model includes convolutional layers and an attention module. Weights learned in the attention module are used to estimate the action-attribution scores. A trained version of the model is stored.
    Type: Grant
    Filed: November 20, 2020
    Date of Patent: March 14, 2023
    Assignee: Amazon Technologies, Inc.
    Inventors: Omri Perez, Chirag Mandaviya, Duo Cao
  • Patent number: 10770556
    Abstract: An AlGaN/GaN HEMT based on fluorinated graphene passivation and a manufacturing method thereof. Monolayer graphene (108) is transferred to an AlGaN (104) surface, is treated by using fluoride ions and then is insulated to thereby replace a conventional nitride passivation layer. Then, a high-k material (109) is grown on the graphene (108), and the high-k material (109) and the graphene (108) are jointly used as a gate dielectric for preparing an AlGaN/GaN metal-insulator-semiconductor (MIS) HEMT. Compared with the traditional passivation structure, the graphene (108) has the advantages of small physical thickness (sub-nanometer scale) and low additional threshold voltage. The structure and the method are simple, the effect is remarkable and the application prospect in technical fields of microelectronics and solid-state electronics is wide.
    Type: Grant
    Filed: March 4, 2016
    Date of Patent: September 8, 2020
    Assignee: SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY, CHINESE ACADEMY OF SCIENCE
    Inventors: Xinhong Cheng, Lingyan Shen, Zhongjian Wang, Duo Cao, Li Zheng, Qian Wang, Dongliang Zhang, Jingjie Li, Yuehui Yu
  • Publication number: 20190035901
    Abstract: An AlGaN/GaN HEMT based on fluorinated graphene passivation and a manufacturing method thereof. Monolayer graphene (108) is transferred to an AlGaN (104) surface, is treated by using fluoride ions and then is insulated to thereby replace a conventional nitride passivation layer. Then, a high-k material (109) is grown on the graphene (108), and the high-k material (109) and the graphene (108) are jointly used as a gate dielectric for preparing an AlGaN/GaN metal-insulator-semiconductor (MIS) HEMT. Compared with the traditional passivation structure, the graphene (108) has the advantages of small physical thickness (sub-nanometer scale) and low additional threshold voltage. The structure and the method are simple, the effect is remarkable and the application prospect in technical fields of microelectronics and solid-state electronics is wide.
    Type: Application
    Filed: March 4, 2016
    Publication date: January 31, 2019
    Applicant: SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY, CHINESE ACADEMY OF SCIENCES
    Inventors: XINHONG CHENG, LINGYAN SHEN, ZHONGJIAN WANG, DUO CAO, LI ZHENG, QIAN WANG, DONGLIANG ZHANG, JINGJIE LI, YUEHUI YU