Patents by Inventor Durai Vishak Ramaswamy

Durai Vishak Ramaswamy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230327019
    Abstract: Some embodiments include a ferroelectric transistor having a first electrode and a second electrode. The second electrode is offset from the first electrode by an active region. A transistor gate is along a portion of the active region. The active region includes a first source/drain region adjacent the first electrode, a second source/drain region adjacent the second electrode, and a body region between the first and second source/drain regions. The body region includes a gated channel region adjacent the transistor gate. The active region includes at least one barrier between the second electrode and the gated channel region which is permeable to electrons but not to holes. Ferroelectric material is between the transistor gate and the gated channel region.
    Type: Application
    Filed: June 9, 2023
    Publication date: October 12, 2023
    Applicant: Micron Technology, Inc.
    Inventors: Kamal M. Karda, Haitao Liu, Durai Vishak Ramaswamy Nirmal
  • Patent number: 11594611
    Abstract: Some embodiments include a semiconductor construction having a gate extending into a semiconductor base. Conductively-doped source and drain regions are within the base adjacent the gate. A gate dielectric has a first segment between the source region and the gate, a second segment between the drain region and the gate, and a third segment between the first and second segments. At least a portion of the gate dielectric comprises ferroelectric material. In some embodiments the ferroelectric material is within each of the first, second and third segments. In some embodiments, the ferroelectric material is within the first segment or the third segment. In some embodiments, a transistor has a gate, a source region and a drain region; and has a channel region between the source and drain regions. The transistor has a gate dielectric which contains ferroelectric material between the source region and the gate.
    Type: Grant
    Filed: February 19, 2021
    Date of Patent: February 28, 2023
    Assignee: Micron Technology, Inc.
    Inventors: Durai Vishak Ramaswamy, Kirk D. Prall, Wayne Kinney
  • Publication number: 20210175340
    Abstract: Some embodiments include a semiconductor construction having a gate extending into a semiconductor base. Conductively-doped source and drain regions are within the base adjacent the gate. A gate dielectric has a first segment between the source region and the gate, a second segment between the drain region and the gate, and a third segment between the first and second segments. At least a portion of the gate dielectric comprises ferroelectric material. In some embodiments the ferroelectric material is within each of the first, second and third segments. In some embodiments, the ferroelectric material is within the first segment or the third segment. In some embodiments, a transistor has a gate, a source region and a drain region; and has a channel region between the source and drain regions. The transistor has a gate dielectric which contains ferroelectric material between the source region and the gate.
    Type: Application
    Filed: February 19, 2021
    Publication date: June 10, 2021
    Applicant: Micron Technology, Inc.
    Inventors: Durai Vishak Ramaswamy, Kirk D. Prall, Wayne Kinney
  • Patent number: 10943986
    Abstract: Some embodiments include a semiconductor construction having a gate extending into a semiconductor base. Conductively-doped source and drain regions are within the base adjacent the gate. A gate dielectric has a first segment between the source region and the gate, a second segment between the drain region and the gate, and a third segment between the first and second segments. At least a portion of the gate dielectric comprises ferroelectric material. In some embodiments the ferroelectric material is within each of the first, second and third segments. In some embodiments, the ferroelectric material is within the first segment or the third segment. In some embodiments, a transistor has a gate, a source region and a drain region; and has a channel region between the source and drain regions. The transistor has a gate dielectric which contains ferroelectric material between the source region and the gate.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: March 9, 2021
    Assignee: Micron Technology, Inc.
    Inventors: Durai Vishak Ramaswamy, Kirk D. Prall, Wayne Kinney
  • Publication number: 20180122917
    Abstract: Some embodiments include a semiconductor construction having a gate extending into a semiconductor base. Conductively-doped source and drain regions are within the base adjacent the gate. A gate dielectric has a first segment between the source region and the gate, a second segment between the drain region and the gate, and a third segment between the first and second segments. At least a portion of the gate dielectric comprises ferroelectric material. In some embodiments the ferroelectric material is within each of the first, second and third segments. In some embodiments, the ferroelectric material is within the first segment or the third segment. In some embodiments, a transistor has a gate, a source region and a drain region; and has a channel region between the source and drain regions. The transistor has a gate dielectric which contains ferroelectric material between the source region and the gate.
    Type: Application
    Filed: December 29, 2017
    Publication date: May 3, 2018
    Applicant: Micron Technology, Inc.
    Inventors: Durai Vishak Ramaswamy, Kirk D. Prall, Wayne Kinney
  • Patent number: 9882016
    Abstract: Some embodiments include a semiconductor construction having a gate extending into a semiconductor base. Conductively-doped source and drain regions are within the base adjacent the gate. A gate dielectric has a first segment between the source region and the gate, a second segment between the drain region and the gate, and a third segment between the first and second segments. At least a portion of the gate dielectric comprises ferroelectric material. In some embodiments the ferroelectric material is within each of the first, second and third segments. In some embodiments, the ferroelectric material is within the first segment or the third segment. In some embodiments, a transistor has a gate, a source region and a drain region; and has a channel region between the source and drain regions. The transistor has a gate dielectric which contains ferroelectric material between the source region and the gate.
    Type: Grant
    Filed: January 20, 2017
    Date of Patent: January 30, 2018
    Assignee: Micron Technology, Inc.
    Inventors: Durai Vishak Ramaswamy, Kirk D. Prall, Wayne Kinney
  • Publication number: 20170133478
    Abstract: Some embodiments include a semiconductor construction having a gate extending into a semiconductor base. Conductively-doped source and drain regions are within the base adjacent the gate. A gate dielectric has a first segment between the source region and the gate, a second segment between the drain region and the gate, and a third segment between the first and second segments. At least a portion of the gate dielectric comprises ferroelectric material. In some embodiments the ferroelectric material is within each of the first, second and third segments. In some embodiments, the ferroelectric material is within the first segment or the third segment. In some embodiments, a transistor has a gate, a source region and a drain region; and has a channel region between the source and drain regions. The transistor has a gate dielectric which contains ferroelectric material between the source region and the gate.
    Type: Application
    Filed: January 20, 2017
    Publication date: May 11, 2017
    Inventors: Durai Vishak Ramaswamy, Kirk D. Prall, Wayne Kinney
  • Patent number: 9590066
    Abstract: Some embodiments include a semiconductor construction having a gate extending into a semiconductor base. Conductively-doped source and drain regions are within the base adjacent the gate. A gate dielectric has a first segment between the source region and the gate, a second segment between the drain region and the gate, and a third segment between the first and second segments. At least a portion of the gate dielectric comprises ferroelectric material. In some embodiments the ferroelectric material is within each of the first, second and third segments. In some embodiments, the ferroelectric material is within the first segment or the third segment. In some embodiments, a transistor has a gate, a source region and a drain region; and has a channel region between the source and drain regions. The transistor has a gate dielectric which contains ferroelectric material between the source region and the gate.
    Type: Grant
    Filed: January 8, 2016
    Date of Patent: March 7, 2017
    Assignee: Micron Technology, Inc.
    Inventors: Durai Vishak Ramaswamy, Kirk D. Prall, Wayne Kinney
  • Publication number: 20160133717
    Abstract: Some embodiments include a semiconductor construction having a gate extending into a semiconductor base. Conductively-doped source and drain regions are within the base adjacent the gate. A gate dielectric has a first segment between the source region and the gate, a second segment between the drain region and the gate, and a third segment between the first and second segments. At least a portion of the gate dielectric comprises ferroelectric material. In some embodiments the ferroelectric material is within each of the first, second and third segments. In some embodiments, the ferroelectric material is within the first segment or the third segment. In some embodiments, a transistor has a gate, a source region and a drain region; and has a channel region between the source and drain regions. The transistor has a gate dielectric which contains ferroelectric material between the source region and the gate.
    Type: Application
    Filed: January 8, 2016
    Publication date: May 12, 2016
    Applicant: Micron Technology, Inc.
    Inventors: Durai Vishak Ramaswamy, Kirk D. Prall, Wayne Kinney