Patents by Inventor Durodami J. Lisk

Durodami J. Lisk has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Enhanced package thermal management using external and internal capacitive thermal material
    Patent number: 9136202
    Abstract: An apparatus has external and/or internal capacitive thermal material for enhanced thermal package management. The apparatus includes an integrated circuit (IC) package having a heat generating device. The apparatus also includes a heat spreader having a first side that is attached to the IC package. The apparatus also includes capacitive thermal material reservoirs contacting the first side of the heat spreader. The capacitive thermal material reservoirs may be disposed laterally relative to the heat generating device.
    Type: Grant
    Filed: April 17, 2012
    Date of Patent: September 15, 2015
    Assignee: QUALCOMM Incorporated
    Inventors: Victor A. Chiriac, Durodami J. Lisk, Ratibor Radojcic
  • THERMAL MANAGEMENT FLOORPLAN FOR A MULTI-TIER STACKED IC PACKAGE
    Publication number: 20130286595
    Abstract: A first tier die is provided having a thermal management floorplan with a heat region having an area for thermal coupling to a heat sink, a second tier die is provided, shaped and dimensioned to be stackable into a multi-tier stack with the first tier die and, when stacked in the multi-tier stack, to not substantially overlap the heat region. A heat sink is provided, and a thermal coupling element, the heat sink, a stack having the first tier die and the second tier die, and the heat sink are arranged to form the multi-tier stacked integrated circuit. In the arrangement, the thermal coupling element is located to form a thermal path from the heat region of the first tier die to the heat sink.
    Type: Application
    Filed: November 19, 2012
    Publication date: October 31, 2013
    Applicant: QUALCOMM INCORPORATED
    Inventors: Durodami J. Lisk, Victor A. Chiriac, Ratibor Rakojcic
  • ENHANCED PACKAGE THERMAL MANAGEMENT USING EXTERNAL AND INTERNAL CAPACITIVE THERMAL MATERIAL
    Publication number: 20130270721
    Abstract: An apparatus has external and/or internal capacitive thermal material for enhanced thermal package management. The apparatus includes an integrated circuit (IC) package having a heat generating device. The apparatus also includes a heat spreader having a first side that is attached to the IC package. The apparatus also includes capacitive thermal material reservoirs contacting the first side of the heat spreader. The capacitive thermal material reservoirs may be disposed laterally relative to the heat generating device.
    Type: Application
    Filed: April 17, 2012
    Publication date: October 17, 2013
    Applicant: QUALCOMM Incorporated
    Inventors: Victor A. Chiriac, Durodami J. Lisk, Ratibor Radojcic
  • Systems and Methods Providing Arrangements of Vias
    Publication number: 20110193212
    Abstract: A semiconductor chip includes an array of electrical contacts and multiple vias coupling at least one circuit in the semiconductor chip to the array of electrical contacts. A first one of the electrical contacts of the array of electrical contacts is coupled to N vias, and a second one of the electrical contacts of the array of electrical contacts is coupled to M vias. M and N are positive integers of different values.
    Type: Application
    Filed: February 8, 2010
    Publication date: August 11, 2011
    Applicant: QUALCOMM INCORPORATED
    Inventors: Shiqun Gu, Matthew Michael Nowak, Durodami J. Lisk, Thomas R. Toms, Urmi Ray, Jungwon Suh, Arvind Chandrasekaran