Patents by Inventor Durron A. Hutt

Durron A. Hutt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9034063
    Abstract: A method of manufacturing grooved polishing layers for use in chemical mechanical polishing pads is provided, wherein the formation of defects in the polishing layers are minimized.
    Type: Grant
    Filed: September 27, 2012
    Date of Patent: May 19, 2015
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Jeffrey James Hendron, Kenneth Vavala, Jeffrey Borcherdt Miller, Brian T. Cantrell, James T. Murnane, Kathleen McHugh, George H. McClain, Durron A. Hutt, Robert A. Brady, Christopher A. Young
  • Patent number: 8986585
    Abstract: A method of manufacturing polishing layers having a window for use in chemical mechanical polishing pads is provided, wherein a plurality of polishing layers having an integral window are derived from a cake, wherein the formation of density defects in the cake and the surface roughness of the polishing layers formed are minimized.
    Type: Grant
    Filed: March 22, 2012
    Date of Patent: March 24, 2015
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Brian T. Cantrell, Kathleen McHugh, James T. Murnane, George H. McClain, Durron A. Hutt, Robert A. Brady, Christopher A. Young, Jeffrey Borcherdt Miller
  • Patent number: 8709114
    Abstract: A method of manufacturing polishing layers for use in chemical mechanical polishing pads is provided, wherein a plurality of polishing layers are derived from a cake, wherein the formation of density defects in the cake and the surface roughness of the polishing layers formed are minimized.
    Type: Grant
    Filed: March 22, 2012
    Date of Patent: April 29, 2014
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Brian T. Cantrell, Kathleen McHugh, James T. Murnane, George H. McClain, Durron A. Hutt, Robert A. Brady, Christopher A. Young, Jeffrey Borcherdt Miller
  • Publication number: 20140083018
    Abstract: A method of manufacturing grooved polishing layers for use in chemical mechanical polishing pads is provided, wherein the formation of defects in the polishing layers are minimized.
    Type: Application
    Filed: September 27, 2012
    Publication date: March 27, 2014
    Applicant: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Jeffrey James Hendron, Kenneth Vavala, Jeffrey Borcherdt Miller, Brian T. Cantrell, James T. Murnane, Kathleen McHugh, George H. McClain, Durron A. Hutt, Robert A. Brady, Christopher A. Young
  • Publication number: 20130247476
    Abstract: A method of manufacturing polishing layers for use in chemical mechanical polishing pads is provided, wherein a plurality of polishing layers are derived from a cake, wherein the formation of density defects in the cake and the surface roughness of the polishing layers formed are minimized.
    Type: Application
    Filed: March 22, 2012
    Publication date: September 26, 2013
    Applicant: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Brian T. Cantrell, Kathleen McHugh, James T. Murnane, George H. McClain, Durron A. Hutt, Robert A. Brady, Christopher A. Young, Jeffrey Borcherdt Miller
  • Publication number: 20130247477
    Abstract: A method of manufacturing polishing layers having a window for use in chemical mechanical polishing pads is provided, wherein a plurality of polishing layers having an integral window are derived from a cake, wherein the formation of density defects in the cake and the surface roughness of the polishing layers formed are minimized.
    Type: Application
    Filed: March 22, 2012
    Publication date: September 26, 2013
    Applicant: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Brian T. Cantrell, Kathleen McHugh, James T. Murnane, George H. McClain, Durron A. Hutt, Robert A. Brady, Christopher A. Young, Jeffrey Borcherdt Miller
  • Publication number: 20130042536
    Abstract: A method of manufacturing polishing layers for use in chemical mechanical polishing pads is provided, wherein the formation of density defects in the polishing layers is minimized.
    Type: Application
    Filed: August 16, 2011
    Publication date: February 21, 2013
    Applicant: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Kathleen McHugh, James T. Murnane, George H. McClain, Durron A. Hutt, Robert A. Brady, Christopher A. Young