Patents by Inventor Dushmantha Bandara RAJAPAKSHA
Dushmantha Bandara RAJAPAKSHA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230336083Abstract: A semiconductor package includes a transformer having a primary winding and a secondary winding. The primary winding has first and second terminals and a pair of taps. The secondary winding has first and second terminals and a pair of taps. The semiconductor package includes first and second data transfer circuits, a bridge, and a rectifier. The first data transfer circuit is coupled to the pair of taps of the primary winding. The second data transfer circuit is coupled to the pair of taps of the secondary winding. The bridge is coupled to the first and second terminals of the primary winding. The rectifier is coupled to the first and second terminals of the secondary winding.Type: ApplicationFiled: July 19, 2022Publication date: October 19, 2023Applicant: TEXAS INSTRUMENTS INCORPORATEDInventors: Dushmantha Bandara RAJAPAKSHA, Roland SPERLICH, Anant Shankar KAMATH, Vijayalakshmi DEVARAJAN, Wesley RAY
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Patent number: 11443889Abstract: A semiconductor package includes a transformer having a primary winding and a secondary winding. The primary winding has first and second terminals and a pair of taps. The secondary winding has first and second terminals and a pair of taps. The semiconductor package includes first and second data transfer circuits, a bridge, and a rectifier. The first data transfer circuit is coupled to the pair of taps of the primary winding. The second data transfer circuit is coupled to the pair of taps of the secondary winding. The bridge is coupled to the first and second terminals of the primary winding. The rectifier is coupled to the first and second terminals of the secondary winding.Type: GrantFiled: June 17, 2020Date of Patent: September 13, 2022Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Dushmantha Bandara Rajapaksha, Roland Sperlich, Anant Shankar Kamath, Vijayalakshmi Devarajan, Wesley Ray
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Patent number: 11380631Abstract: A lead frame for a multi-chip module includes a first conductor structure disposed on a substrate and having first and second arms linked at an angle. The first conductor structure is connected to ground. The lead frame also includes a second conductor structure disposed on the substrate and connected to a voltage supply. The second conductor structure is spaced apart and electrically isolated from the first conductor structure. The first and the second conductor structures are arranged to flank a plurality of integrated circuits (ICs) including one or more surge protection ICs disposed on the substrate. The first conductor structure is electrically connected to the plurality of ICs to provide electrical connections to ground, and the second conductor structure is electrically connected to the plurality of ICs to provide electrical connections to the voltage supply.Type: GrantFiled: November 27, 2019Date of Patent: July 5, 2022Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Dushmantha Bandara Rajapaksha, Vijayalakshmi Devarajan, Roland Sperlich, Wesley Ray
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Patent number: 11336331Abstract: Systems and methods are disclosed for an integrated circuit (IC) comprising an oscillator, an on-off-keying modulator configured to modulate input data coupled to the oscillator, a serial communications transmitter coupled to the on-off-keying modulator, a serial communications receiver coupled to the serial communications transmitter by a set of cables, and an envelope detector coupled to the serial communications receiver. In the IC, power and data are simultaneously delivered across the same set of cables from the serial communications transmitter to the serial communications receiver.Type: GrantFiled: May 27, 2021Date of Patent: May 17, 2022Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Dushmantha Bandara Rajapaksha, Wesley Ray, Hao Liu, Maxwell Robertson
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Patent number: 11310072Abstract: A transceiver includes a driver stage and a transient-triggered ring suppression circuit. The driver stage has a first transistor coupled between a supply voltage terminal and a first bus terminal and a second transistor coupled between a ground and a second bus terminal. The transient-triggered ring suppression circuit is coupled to the first and second transistors. The transient-triggered ring suppression circuit is configured to be enabled upon transition of the transceiver from a dominant state to a recessive state. Further, while the transceiver is in the recessive state, the transient-triggered ring suppression circuit is configured to attenuate ringing on at least one of the first or second bus terminals.Type: GrantFiled: October 5, 2020Date of Patent: April 19, 2022Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Richard Sterling Broughton, Vijayalakshmi Devarajan, Wesley Ryan Ray, Dushmantha Bandara Rajapaksha
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Publication number: 20210288690Abstract: Systems and methods are disclosed for an integrated circuit (IC) comprising an oscillator, an on-off-keying modulator configured to modulate input data coupled to the oscillator, a serial communications transmitter coupled to the on-off-keying modulator, a serial communications receiver coupled to the serial communications transmitter by a set of cables, and an envelope detector coupled to the serial communications receiver. In the IC, power and data are simultaneously delivered across the same set of cables from the serial communications transmitter to the serial communications receiver.Type: ApplicationFiled: May 27, 2021Publication date: September 16, 2021Inventors: Dushmantha Bandara RAJAPAKSHA, Wesley RAY, Hao LIU, Maxwell ROBERTSON
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Patent number: 11050460Abstract: Systems and methods are disclosed for an integrated circuit (IC) comprising an oscillator, an on-off-keying modulator configured to modulate input data coupled to the oscillator, a serial communications transmitter coupled to the on-off-keying modulator, a serial communications receiver coupled to the serial communications transmitter by a set of cables, and an envelope detector coupled to the serial communications receiver. In the IC, power and data are simultaneously delivered across the same set of cables from the serial communications transmitter to the serial communications receiver.Type: GrantFiled: June 11, 2019Date of Patent: June 29, 2021Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Dushmantha Bandara Rajapaksha, Wesley Ray, Hao Liu, Maxwell Robertson
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Publication number: 20210167989Abstract: A transceiver includes a driver stage and a transient-triggered ring suppression circuit. The driver stage has a first transistor coupled between a supply voltage terminal and a first bus terminal and a second transistor coupled between a ground and a second bus terminal. The transient-triggered ring suppression circuit is coupled to the first and second transistors. The transient-triggered ring suppression circuit is configured to be enabled upon transition of the transceiver from a dominant state to a recessive state. Further, while the transceiver is in the recessive state, the transient-triggered ring suppression circuit is configured to attenuate ringing on at least one of the first or second bus terminals.Type: ApplicationFiled: October 5, 2020Publication date: June 3, 2021Inventors: Richard Sterling BROUGHTON, Vijayalakshmi DEVARAJAN, Wesley Ryan RAY, Dushmantha Bandara RAJAPAKSHA
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Publication number: 20210159192Abstract: A lead frame for a multi-chip module includes a first conductor structure disposed on a substrate and having first and second arms linked at an angle. The first conductor structure is connected to ground. The lead frame also includes a second conductor structure disposed on the substrate and connected to a voltage supply. The second conductor structure is spaced apart and electrically isolated from the first conductor structure. The first and the second conductor structures are arranged to flank a plurality of integrated circuits (ICs) including one or more surge protection ICs disposed on the substrate. The first conductor structure is electrically connected to the plurality of ICs to provide electrical connections to ground, and the second conductor structure is electrically connected to the plurality of ICs to provide electrical connections to the voltage supply.Type: ApplicationFiled: November 27, 2019Publication date: May 27, 2021Inventors: Dushmantha Bandara Rajapaksha, Vijayalakshmi Devarajan, Roland Sperlich, Wesley Ray
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Publication number: 20200402702Abstract: A semiconductor package includes a transformer having a primary winding and a secondary winding. The primary winding has first and second terminals and a pair of taps. The secondary winding has first and second terminals and a pair of taps. The semiconductor package includes first and second data transfer circuits, a bridge, and a rectifier. The first data transfer circuit is coupled to the pair of taps of the primary winding. The second data transfer circuit is coupled to the pair of taps of the secondary winding. The bridge is coupled to the first and second terminals of the primary winding. The rectifier is coupled to the first and second terminals of the secondary winding.Type: ApplicationFiled: June 17, 2020Publication date: December 24, 2020Inventors: Dushmantha Bandara RAJAPAKSHA, Roland SPERLICH, Anant Shankar KAMATH, Vijayalakshmi DEVARAJAN, Wesley RAY
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Publication number: 20190386703Abstract: Systems and methods are disclosed for an integrated circuit (IC) comprising an oscillator, an on-off-keying modulator configured to modulate input data coupled to the oscillator, a serial communications transmitter coupled to the on-off-keying modulator, a serial communications receiver coupled to the serial communications transmitter by a set of cables, and an envelope detector coupled to the serial communications receiver. In the IC, power and data are simultaneously delivered across the same set of cables from the serial communications transmitter to the serial communications receiver.Type: ApplicationFiled: June 11, 2019Publication date: December 19, 2019Inventors: Dushmantha Bandara RAJAPAKSHA, Wesley RAY, Hao LIU, Maxwell ROBERTSON