Patents by Inventor Dustin M. Fregeau
Dustin M. Fregeau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10571490Abstract: A probe tip structure that decreases the accumulation rate of Sn particles to the probe tip and enables considerably more efficient and complete laser cleaning is disclosed. In an embodiment, the probe structure includes an array of probe tips, each probe tip having an inner core; an interfacial layer bonded to the inner core; and an outer layer bonded to the interfacial layer, wherein the outer layer is resistant to adherence of the solder of the ball grid array package.Type: GrantFiled: October 26, 2017Date of Patent: February 25, 2020Assignee: International Business Machines CorporationInventors: David M. Audette, Dennis M. Bronson, Jr., Joseph K. V. Comeau, Dustin M. Fregeau, David L. Gardell, Frederick H. Roy, III, James R. Salimeno, III, Timothy D. Sullivan
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Publication number: 20180059141Abstract: A probe tip structure that decreases the accumulation rate of Sn particles to the probe tip and enables considerably more efficient and complete laser cleaning is disclosed. In an embodiment, the probe structure includes an array of probe tips, each probe tip having an inner core; an interfacial layer bonded to the inner core; and an outer layer bonded to the interfacial layer, wherein the outer layer is resistant to adherence of the solder of the ball grid array package.Type: ApplicationFiled: October 26, 2017Publication date: March 1, 2018Inventors: David M. Audette, Dennis M. Bronson, Jr., Joseph K. V. Comeau, Dustin M. Fregeau, David L. Gardell, Frederick H. Roy, III, James R. Salimeno, III, Timothy D. Sullivan
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Patent number: 9835653Abstract: A probe tip structure that decreases the accumulation rate of Sn particles to the probe tip and enables considerably more efficient and complete laser cleaning is disclosed. In an embodiment, the probe structure includes an array of probe tips, each probe tip having an inner core; an interfacial layer bonded to the inner core; and an outer layer bonded to the interfacial layer, wherein the outer layer is resistant to adherence of the solder of the ball grid array package.Type: GrantFiled: May 13, 2014Date of Patent: December 5, 2017Assignee: International Business Machines CorporationInventors: David M. Audette, Dennis M. Bronson, Jr., Joseph K. V. Comeau, Dustin M. Fregeau, David L. Gardell, Frederick H. Roy, III, James R. Salimeno, III, Timothy D. Sullivan
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Patent number: 9335346Abstract: An electrical connection includes a first electrical contact made of electrically conductive material. The first electrical contact is formed with a depression therein. Also included are a deformable pad, having a Young's modulus of less than 1,000,000 psi, which bears on the first contact; and a second electrical contact, made of electrically conductive material, which contacts the first electrical contact and is at least partially received into the depression. The deformable pad at least partially causes at least one lateral force on the first electrical contact, so as to induce the first electrical contact to make an electrical connection with the second electrical contact. An array of such contacts is also contemplated, as is an array of cantilevered contacts, which may or may not have depressions, and which are supported by at least one elastomeric pad, having a Young's modulus of less 72,500 psi.Type: GrantFiled: September 10, 2012Date of Patent: May 10, 2016Assignee: GLOBALFOUNDRIES INC.Inventors: S. Jay Chey, Dustin M. Fregeau, Donna S. Zupanski-Nielsen, Aparna Prabhakar, Pavan Samudrala, Mohammed S. Shaikh
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Publication number: 20150331014Abstract: A probe tip structure that decreases the accumulation rate of Sn particles to the probe tip and enables considerably more efficient and complete laser cleaning is disclosed. In an embodiment, the probe structure includes an array of probe tips, each probe tip having an inner core; an interfacial layer bonded to the inner core; and an outer layer bonded to the interfacial layer, wherein the outer layer is resistant to adherence of the solder of the ball grid array package.Type: ApplicationFiled: May 13, 2014Publication date: November 19, 2015Applicant: International Business Machines CorporationInventors: David M. Audette, Dennis M. Bronson, JR., Joseph K. V. Comeau, Dustin M. Fregeau, David L. Gardell, Frederick H. Roy, III, James R. Salimeno, III, Timothy D. Sullivan
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Patent number: 9057741Abstract: Probes are directly patterned on a test substrate, thereby eliminating a need for an interposer. Probe contact structures are formed as a two-level structure having a greater lateral dimension for a lower level portion than for an upper level portion. First cavities are formed in a masking layer applied to a test substrate, filling the cavities with a conductive material, and planarizing the top surfaces of the conductive material portions to form lower level portions. Another masking layer is applied over the lower level portions and patterned to define second cavities having a smaller lateral dimension that the lower level portions. The second cavities are filled with at least one conductive material to form upper level portions of the probe contact structures. The upper level portion of each probe contact structure can be employed to penetrate a surface oxide of solder balls.Type: GrantFiled: July 20, 2012Date of Patent: June 16, 2015Assignee: International Business Machines CorporationInventors: David M. Audette, Kevin Bocash, S. Jay Chey, Steven A. Cordes, Dustin M. Fregeau
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Patent number: 8933717Abstract: Probes are directly patterned on a test substrate, thereby eliminating a need for an interposer. Probe contact structures are formed as a two-level structure having a greater lateral dimension for a lower level portion than for an upper level portion. First cavities are formed in a masking layer applied to a test substrate, filling the cavities with a conductive material, and planarizing the top surfaces of the conductive material portions to form lower level portions. Another masking layer is applied over the lower level portions and patterned to define second cavities having a smaller lateral dimension that the lower level portions. The second cavities are filled with at least one conductive material to form upper level portions of the probe contact structures. The upper level portion of each probe contact structure can be employed to penetrate a surface oxide of solder balls.Type: GrantFiled: June 21, 2012Date of Patent: January 13, 2015Assignee: International Business Machines CorporationInventors: David M. Audette, Kevin Bocash, S. Jay Chey, Steven A. Cordes, Dustin M. Fregeau
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Patent number: 8836356Abstract: A vertical probe assembly includes an upper die; a lower die; a plurality of probes, the probes including an electrically conductive material, wherein the probes extend from the upper die through the lower die; and an air channel located between the upper die and the lower die, such that airflow through the air channel passes through the plurality of probes.Type: GrantFiled: December 12, 2011Date of Patent: September 16, 2014Assignee: International Business Machines CorporationInventors: David M. Audette, Dustin M. Fregeau, David L. Gardell, Daniel J. Murphy, Grant Wagner
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Publication number: 20130344694Abstract: Probes are directly patterned on a test substrate, thereby eliminating a need for an interposer. Probe contact structures are formed as a two-level structure having a greater lateral dimension for a lower level portion than for an upper level portion. First cavities are formed in a masking layer applied to a test substrate, filling the cavities with a conductive material, and planarizing the top surfaces of the conductive material portions to form lower level portions. Another masking layer is applied over the lower level portions and patterned to define second cavities having a smaller lateral dimension that the lower level portions. The second cavities are filled with at least one conductive material to form upper level portions of the probe contact structures. The upper level portion of each probe contact structure can be employed to penetrate a surface oxide of solder balls.Type: ApplicationFiled: July 20, 2012Publication date: December 26, 2013Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: David M. Audette, Kevin Bocash, S. Jay Chey, Steven A. Cordes, Dustin M. Fregeau
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Publication number: 20130342234Abstract: Probes are directly patterned on a test substrate, thereby eliminating a need for an interposer. Probe contact structures are formed as a two-level structure having a greater lateral dimension for a lower level portion than for an upper level portion. First cavities are formed in a masking layer applied to a test substrate, filling the cavities with a conductive material, and planarizing the top surfaces of the conductive material portions to form lower level portions. Another masking layer is applied over the lower level portions and patterned to define second cavities having a smaller lateral dimension that the lower level portions. The second cavities are filled with at least one conductive material to form upper level portions of the probe contact structures. The upper level portion of each probe contact structure can be employed to penetrate a surface oxide of solder balls.Type: ApplicationFiled: June 21, 2012Publication date: December 26, 2013Applicant: Intenational Business Machines CorporationInventors: David M. AUDETTE, Kevin BOCASH, S. Jay CHEY, Steven A. CORDES, Dustin M. FREGEAU
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Patent number: 8487304Abstract: An electrical connection includes a first electrical contact made of electrically conductive material. The first electrical contact is formed with a depression therein. Also included are a deformable pad, having a Young's modulus of less than 1,000,000 psi, which bears on the first contact; and a second electrical contact, made of electrically conductive material, which contacts the first electrical contact and is at least partially received into the depression. The deformable pad at least partially causes at least one lateral force on the first electrical contact, so as to induce the first electrical contact to make an electrical connection with the second electrical contact. An array of such contacts is also contemplated, as is an array of cantilevered contacts, which may or may not have depressions, and which are supported by at least one elastomeric pad, having a Young's modulus of less 72,500 psi.Type: GrantFiled: April 30, 2010Date of Patent: July 16, 2013Assignee: International Business Machines CorporationInventors: S. Jay Chey, Dustin M. Fregeau, Donna S. Zupanski-Nielsen, Aparna Prabhakar, Pavan Samudrala, Mohammed S. Shaikh
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Publication number: 20130147502Abstract: A vertical probe assembly includes an upper die; a lower die; a plurality of probes, the probes comprising an electrically conductive material, wherein the probes extend from the upper die through the lower die; and an air channel located between the upper die and the lower die, such that airflow through the air channel passes through the plurality of probes.Type: ApplicationFiled: December 12, 2011Publication date: June 13, 2013Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: David M. Audette, Dustin M. Fregeau, David L. Gardell, Daniel J. Murphy, Grant Wagner
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Publication number: 20120329295Abstract: An electrical connection includes a first electrical contact made of electrically conductive material. The first electrical contact is formed with a depression therein. Also included are a deformable pad, having a Young's modulus of less than 1,000,000 psi, which bears on the first contact; and a second electrical contact, made of electrically conductive material, which contacts the first electrical contact and is at least partially received into the depression. The deformable pad at least partially causes at least one lateral force on the first electrical contact, so as to induce the first electrical contact to make an electrical connection with the second electrical contact. An array of such contacts is also contemplated, as is an array of cantilevered contacts, which may or may not have depressions, and which are supported by at least one elastomeric pad, having a Young's modulus of less 72,500 psi.Type: ApplicationFiled: September 10, 2012Publication date: December 27, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: S. Jay Chey, Dustin M. Fregeau, Donna S. Zupanski-Nielsen, Aparna Prabhakar, Pavan Samudrala, Mohammed S. Shaikh
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Publication number: 20110266539Abstract: An electrical connection includes a first electrical contact made of electrically conductive material. The first electrical contact is formed with a depression therein. Also included are a deformable pad, having a Young's modulus of less than 1,000,000 psi, which bears on the first contact; and a second electrical contact, made of electrically conductive material, which contacts the first electrical contact and is at least partially received into the depression. The deformable pad at least partially causes at least one lateral force on the first electrical contact, so as to induce the first electrical contact to make an electrical connection with the second electrical contact. An array of such contacts is also contemplated, as is an array of cantilevered contacts, which may or may not have depressions, and which are supported by at least one elastomeric pad, having a Young's modulus of less 72,500 psi.Type: ApplicationFiled: April 30, 2010Publication date: November 3, 2011Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: S. Jay Chey, Dustin M. Fregeau, Donna S. Zupanski-Nielsen, Aparna Prabhakar, Pavan Samudrala, Mohammed S. Shaikh