Patents by Inventor Dustin M. Meier

Dustin M. Meier has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250084927
    Abstract: The pressure relief assembly has a valve body constructed of breathable porous plastic. The valve body has an outer perimetric surface defining a detent mating surface and a sealing surface configured to form a seal around a valve opening. A first detent has a detent engagement surface configured to releasably engage the detent mating surface. The first detent is configured to release the valve body upon a minimum pressure differential across the valve body. The first detent is configured to extent laterally outward from the detent mating surface. The pressure relief assembly has a frame having a coupling structure configured to couple to an enclosure. The pressure relief assembly has a valve mounting surface and a valve opening within the valve mounting surface, where the valve body is sealably disposed on the valve mounting surface across the valve opening.
    Type: Application
    Filed: September 6, 2024
    Publication date: March 13, 2025
    Inventors: Matthew P. Brownson, Isaac J. Laffey, Matthew J. Goode, Aflal Rahmathullah, Suresh B. Bommineni, Daniel P. Little, Marc J. Andvik, Robert O. Nelson, Michael S. Libbey, Dustin M. Meier