Patents by Inventor Duy Le

Duy Le has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170364143
    Abstract: Haptic effects are automatically localized on a user's body based on multimedia content or its associated metadata. A haptic effect generator analyzes multimedia content to determine haptic events that occur in the multimedia content. It then generates a haptic effect based on the haptic event. A localizer receives the haptic effect from the haptic effect generator and automatically correlates the haptic effect to a portion of a body based on multimedia content information. The multimedia content information can include the multimedia content and the metadata and the like. The localizer uses a threshold value associated with the haptic event to determine when and where the haptic effect should be localized. The localizer can also utilize a body model to facilitate in localizing the haptic effect.
    Type: Application
    Filed: December 18, 2015
    Publication date: December 21, 2017
    Inventors: Fabien DANIEAU, Julien FLEUREAU, Khanh-Duy LE
  • Publication number: 20170214034
    Abstract: Embodiments described in this application relate generally to a system, an apparatus and/or methods for manufacturing electrodes by infusion electrolyte into compacted electrode materials. In some embodiments, a working electrode materials can be produced using an infusion mixing and manufacturing process. In some embodiments, a single-sided finished electrode can be produced directly from a dry powder mixture using an infusion mixing and manufacturing process. In some embodiments, a double-sided finished electrode can be produced directly from a dry powder mixture using an infusion mixing and manufacturing process. The electrodes produced by an infusion mixing and manufacturing process generally perform better than those produced by non-infusion processes.
    Type: Application
    Filed: January 17, 2017
    Publication date: July 27, 2017
    Inventors: Naoki Ota, Takaaki Fukushima, Yutaka Wakai, Motoi Tamaki, Sean Simon, Nicholas Varamo, Duy Le, Taison Tan, Hiromitsu Mishima
  • Patent number: 9471299
    Abstract: Disclosed are various embodiments for providing updateable code to a software library executed in a client device. Updateable code includes scripting language code and potentially other content employed by a software library invoked by an application executed by a client device. Updateable code can be updated upon launch of the application and/or upon invocation of a call associated with the software library.
    Type: Grant
    Filed: March 25, 2013
    Date of Patent: October 18, 2016
    Assignee: Amazon Technologies, Inc.
    Inventors: Michael Thor Nelson, Steven Eric Schiesser, Mobeen Fikree, Christopher Lawrence Lavin, Anthony Warren Sajec, Tuan Duy Le
  • Patent number: 8033860
    Abstract: A stack able patch cable for splitting an electrical signal is described. The patch cable includes two plug members connected via a cable. Each plug member includes a male end and a female end. The male end has a male signal contact and a male shield contact electrically isolated from the male signal contact. The female end includes a female signal contact and a female shield contact electrically isolated from the female signal contact. Additionally, the female signal contact is electrically connected with the male signal contact and the female shield contact is electrically connected with the male shield contact. Further, the female end is configured to receive a male end of a plug to electrically connect the corresponding contacts. Thus, the plug member is capable of receiving and connecting directly with another plug member to split a signal while maintaining signal quality.
    Type: Grant
    Filed: December 28, 2009
    Date of Patent: October 11, 2011
    Inventors: Gur Yitzhak Milstein, Duy Le
  • Publication number: 20100173525
    Abstract: A stack able patch cable for splitting an electrical signal is described. The patch cable includes two plug members connected via a cable. Each plug member includes a male end and a female end. The male end has a male signal contact and a male shield contact electrically isolated from the male signal contact. The female end includes a female signal contact and a female shield contact electrically isolated from the female signal contact. Additionally, the female signal contact is electrically connected with the male signal contact and the female shield contact is electrically connected with the male shield contact. Further, the female end is configured to receive a male end of a plug to electrically connect the corresponding contacts. Thus, the plug member is capable of receiving and connecting directly with another plug member to split a signal while maintaining signal quality.
    Type: Application
    Filed: December 28, 2009
    Publication date: July 8, 2010
    Inventors: GUR YITZHAK MILSTEIN, DUY LE
  • Patent number: 7019519
    Abstract: A method for monitoring an inspection sample includes generating inspection data comprising resistance and reactance measurements that are obtained from an inspection sample having a conductive layer of unknown thickness. Calibration data is used for estimating the thickness of the conductive layer of the inspection sample. This calibration data includes resistance and reactance measurements obtained from one or more calibration samples, each calibration sample having a conductive layer of known thickness. The conductive layers of the inspection sample and the calibration samples comprise different materials having a known conductive relationship.
    Type: Grant
    Filed: August 24, 2004
    Date of Patent: March 28, 2006
    Inventor: Cuong Duy Le
  • Patent number: 6762604
    Abstract: A standalone eddy current monitoring system provides a thickness profile of a substrate sample by obtaining initial and terminating resistance and reactance measurements from the sample. Initial eddy current measurement values are obtained while an eddy current probe is positioned at an initial distance relative to the substrate sample, and terminating values are obtained while the eddy current probe is positioned at a modified distance relative to the sample. An intersecting line can be calculated using the initial and terminating resistance and reactance measurements. An intersecting point between a previously defined natural intercepting curve and the intersecting line may also be determined. A reactance voltage of the intersecting point may be located along a digital calibration curve to identify a closest-two of a plurality of calibration samples.
    Type: Grant
    Filed: April 14, 2003
    Date of Patent: July 13, 2004
    Inventor: Cuong Duy Le
  • Patent number: 6741076
    Abstract: A method for estimating a thickness profile of a substrate sample that has undergone a chemical-mechanical polishing (CMP) process includes obtaining initial and terminating resistance and reactance measurements from the sample. Initial eddy current measurement values are obtained while an eddy current probe is positioned at an initial distance relative to the substrate sample, and terminating values are obtained while the eddy current probe is positioned at a modified distance relative to the sample. An intersecting line can be calculated using the initial and terminating resistance and reactance measurements. An intersecting point between a previously defined natural intercepting curve and the intersecting line may also be determined. A reactance voltage of the intersecting point may be located along a digital calibration curve to identify a closest-two of a plurality of calibration samples.
    Type: Grant
    Filed: April 14, 2003
    Date of Patent: May 25, 2004
    Inventor: Cuong Duy Le
  • Publication number: 20040070393
    Abstract: In a first aspect, a method of inspecting objects is provided. The method includes the steps of (1) measuring sheet resistance of a first stack of conducting films deposited on an object, said first stack having a topmost conducting film; (2) depositing a subsequent conducting film on said first stack of conducting films to form a second stack; (3) measuring sheet resistance of said second stack; and (4) calculating sheet resistance of the subsequent conducting film. A thickness of the subsequent conducting film may be determined based on the sheet resistance of the subsequent conducting film. Numerous other aspects are provided.
    Type: Application
    Filed: April 8, 2003
    Publication date: April 15, 2004
    Inventors: Moshe Sarfaty, Ramaswamy Sreenivasan, Cuong Duy Le
  • Publication number: 20030210042
    Abstract: A standalone eddy current monitoring system provides a thickness profile of a substrate sample by obtaining initial and terminating resistance and reactance measurements from the sample. Initial eddy current measurement values are obtained while an eddy current probe is positioned at an initial distance relative to the substrate sample, and terminating values are obtained while the eddy current probe is positioned at a modified distance relative to the sample. An intersecting line can be calculated using the initial and terminating resistance and reactance measurements. An intersecting point between a previously defined natural intercepting curve and the intersecting line may also be determined. A reactance voltage of the intersecting point may be located along a digital calibration curve to identify a closest-two of a plurality of calibration samples.
    Type: Application
    Filed: April 14, 2003
    Publication date: November 13, 2003
    Inventor: Cuong Duy Le
  • Publication number: 20030210041
    Abstract: A method for estimating a thickness profile of a substrate sample that has undergone a chemical vapor deposition (CVD) process includes obtaining initial eddy current measurement values while an eddy current probe is positioned at an initial distance relative to the substrate sample. Terminating values are obtained while the eddy current probe is positioned at a modified distance relative to the sample. An intersecting line can be calculated using the initial and terminating resistance and reactance measurements. An intersecting point between a previously defined natural intercepting curve and the intersecting line may also be determined. A reactance voltage of the intersecting point may be located along a digital calibration curve to identify a closest-two of a plurality of calibration samples.
    Type: Application
    Filed: April 14, 2003
    Publication date: November 13, 2003
    Inventor: Cuong Duy Le
  • Publication number: 20030206009
    Abstract: A system for monitoring a plurality of semiconductor fabrication systems includes a communication link between each of the semiconductor fabrication systems and the monitoring system. In operation, initial eddy current measurement values are obtained while an eddy current probe is positioned at an initial distance relative to the substrate sample, and terminating values are obtained while the eddy current probe is positioned at a modified distance relative to the sample. An intersecting line can be calculated using the initial and terminating resistance and reactance measurements. An intersecting point between a previously defined natural intercepting curve and the intersecting line may also be determined. A reactance voltage of the intersecting point may be located along a digital calibration curve to identify a closest-two of a plurality of calibration samples.
    Type: Application
    Filed: April 14, 2003
    Publication date: November 6, 2003
    Inventor: Cuong Duy Le
  • Publication number: 20030206008
    Abstract: A method for estimating a thickness profile of a substrate sample that has undergone a physical vapor deposition (PVD) process includes obtaining initial eddy current measurement values while an eddy current probe is positioned at an initial distance relative to the substrate sample. Terminating values are obtained while the eddy current probe is positioned at a modified distance relative to the sample. An intersecting line can be calculated using the initial and terminating resistance and reactance measurements. An intersecting point between a previously defined natural intercepting curve and the intersecting line may also be determined. A reactance voltage of the intersecting point may be located along a digital calibration curve to identify a closest-two of a plurality of calibration samples.
    Type: Application
    Filed: April 14, 2003
    Publication date: November 6, 2003
    Inventor: Cuong Duy Le
  • Publication number: 20030201768
    Abstract: A method for estimating a thickness profile of a substrate sample that has undergone a chemical-mechanical polishing (CMP) process includes obtaining initial and terminating resistance and reactance measurements from the sample. Initial eddy current measurement values are obtained while an eddy current probe is positioned at an initial distance relative to the substrate sample, and terminating values are obtained while the eddy current probe is positioned at a modified distance relative to the sample. An intersecting line can be calculated using the initial and terminating resistance and reactance measurements. An intersecting point between a previously defined natural intercepting curve and the intersecting line may also be determined. A reactance voltage of the intersecting point may be located along a digital calibration curve to identify a closest-two of a plurality of calibration samples.
    Type: Application
    Filed: April 14, 2003
    Publication date: October 30, 2003
    Inventor: Cuong Duy Le
  • Patent number: 6549006
    Abstract: A method for identifying metal layer thickness of an inspection sample according to one embodiment utilizes an eddy current probe to obtain initial resistance and reactance measurements from the inspection sample. Once these measurements have been obtained, the relative distance between the eddy current probe and inspection sample is increased and terminating resistance and reactance measurements are obtained. An inspection sample intersecting line may then be calculated using the initial and terminating resistance and reactance measurements. An intersecting point between a natural intercepting curve and the inspection sample intersecting line may also be determined. A reactance voltage of the intersecting point along a digital calibration curve is calculated to identify a closest two of a plurality of calibration samples. The metal layer thickness of the inspection sample may then be calculated by performing an interpolation between the identified closest two calibration samples.
    Type: Grant
    Filed: April 17, 2001
    Date of Patent: April 15, 2003
    Inventor: Cuong Duy Le
  • Patent number: 6492892
    Abstract: A magnet wire having differential build insulation for use in transformer coils is disclosed. The wire has a rectangular conductor with an insulation that is thicker on the top and bottom surfaces of the wire than it is on the sides. With the thicker coating on the top and bottom, the wire can be used in layer wound distribution transformer coils, both high voltage wire wound coils and low voltage wound coils, without needing additional insulation between the layers of the winding.
    Type: Grant
    Filed: April 3, 1998
    Date of Patent: December 10, 2002
    Assignee: ABB Inc.
    Inventors: Thomas W. Brennan, Norris L. Hill, Hoan Duy Le, Thomas L. Linsenbardt
  • Publication number: 20020149360
    Abstract: A method of measuring a thin film metal coating on wafer products by using eddy current technologies. An absolute shielded probe is used to generate and detect signals in order to measure the resistant path of eddy current that induce into the thin film metal coating on semiconductor wafer products. An alternate magnetic field is adjacent to a conductive material that will generate a closed loop eddy current path. This eddy current is called secondary current which has the same characteristics of a primary current and a magnetic field; such as having the same frequency, having an alternate current mode, always seeking the least resistant path to travel, and producing a secondary alternate magnetic field. An eddy current sensor probe generates a unique characteristic locus of different thickness of the same materials that have the same resistivity.
    Type: Application
    Filed: April 17, 2001
    Publication date: October 17, 2002
    Inventor: Cuong Duy Le
  • Patent number: 6407546
    Abstract: A method and system for identifying thicknesses of inspection samples, such as semiconductor wafers is presented. The method and system includes a probe housing, comprising an eddy current sense coil and a linear motion controller, and a computer that controls the linear motion controller and the eddy current sense coil. The computer may be configured to identify a thickness of the inspection sample by a method comprising the generation of a natural intercepting curve based on resistance and reactance measurements of at least two data points. Then, a plurality of corresponding resistance and reactance measurements of a location on the inspection sample is obtained with the eddy current sensor, where the eddy current sensor makes a first measurement at a first distance from the inspection sample, and makes each of the remaining plurality of measurements at a distance that is incrementally further away from the inspection surface.
    Type: Grant
    Filed: April 7, 2000
    Date of Patent: June 18, 2002
    Inventors: Cuong Duy Le, Anh The Ngo
  • Patent number: 5980995
    Abstract: An insulated metallic strip suitable for use in the coils of power transformers and method of producing the same. Following the extrusion of a flat metallic strip of conductive material for winding into a magnet coil, the flat strip having a predetermined thickness and first and second sides bounded by a pair of fully rounded edges, the method of insulating the strip of conductive material by supporting the flat strip in a level state at a predetermined temperature in a vacuum chamber and while in the vacuum chamber applying a liquid coating of resin to the entire first side of the strip and the pair of rounded edges and extending onto the second side of the strip from each of the edges a distance at least as great as about 0.25" to prevent turn to turn discharge.
    Type: Grant
    Filed: January 19, 1999
    Date of Patent: November 9, 1999
    Assignee: ABB Power T&D Company Inc.
    Inventors: Thomas L. Linsenbardt, Norris L. Hill, Hoan Duy Le
  • Patent number: 5904953
    Abstract: An insulated metallic strip suitable for use in the coils of power transformers and method of producing the same. Following the extrusion of a flat metallic strip of conductive material for winding into a magnet coil, the flat strip having a predetermined thickness and first and second sides bounded by a pair of fully rounded edges, the method of insulating the strip of conductive material by supporting the flat strip in a level state at a predetermined temperature in a vacuum chamber and while in the vacuum chamber applying a liquid coating of resin to the entire first side of the strip and the pair of rounded edges and extending onto the second side of the strip from each of the edges a distance at least as great as about 0.25" to prevent turn to turn discharge.
    Type: Grant
    Filed: February 19, 1997
    Date of Patent: May 18, 1999
    Assignee: ABB Power T&D Company Inc
    Inventors: Thomas L. Linsenbardt, Norris L. Hill, Hoan Duy Le