Abstract: A device has a first semiconductor chip (101) with contact pads in an interior first set (102) and a peripheral second set (103). A deformed sphere (104) of non-reflow metal such as gold is placed on each contact pad of the first and second sets. At least one additional deformed sphere (105) is placed on the first set pads, forming column-shaped spacers. The first chip is attached to a substrate (110) with a chip attachment location and a third set of contact pads (112) near the location. Low profile bond wires (130) span between the pads of the third set and the second set. A second semiconductor chip (140) of a size has a fourth set of contact pads (141) at locations matching the first set pads. The second chip is placed over the first chip so that the fourth set pads are aligned with the spacers on the matching first set pads, and at least one edge of the second chip overhangs the sphere on at least one pad of the second set.

Abstract: A device has a first semiconductor chip (101) with contact pads in an interior first set (102) and a peripheral second set (103). A deformed sphere (104) of non-reflow metal such as gold is placed on each contact pad of the first and second sets. At least one additional deformed sphere (105) is placed on the first set pads, forming column-shaped spacers. The first chip is attached to a substrate (110) with a chip attachment location and a third set of contact pads (112) near the location. Low profile bond wires (130) span between the pads of the third set and the second set. A second semiconductor chip (140) of a size has a fourth set of contact pads (141) at locations matching the first set pads. The second chip is placed over the first chip so that the fourth set pads are aligned with the spacers on the matching first set pads, and at least one edge of the second chip overhangs the sphere on at least one pad of the second set.

Abstract: A device has a first semiconductor chip (101) with contact pads in an interior first set (102) and a peripheral second set (103). A deformed sphere (104) of non-reflow metal such as gold is placed on each contact pad of the first and second sets. At least one additional deformed sphere (105) is placed on the first set pads, forming column-shaped spacers. The first chip is attached to a substrate (110) with a chip attachment location and a third set of contact pads (112) near the location. Low profile bond wires (130) span between the pads of the third set and the second set. A second semiconductor chip (140) of a size has a fourth set of contact pads (141) at locations matching the first set pads. The second chip is placed over the first chip so that the fourth set pads are aligned with the spacers on the matching first set pads, and at least one edge of the second chip overhangs the sphere on at least one pad of the second set.

Abstract: A device has a first semiconductor chip (101) with contact pads in an interior first set (102) and a peripheral second set (103). A deformed sphere (104) of non-reflow metal such as gold is placed on each contact pad of the first and second sets. At least one additional deformed sphere (105) is placed on the first set pads, forming column-shaped spacers. The first chip is attached to a substrate (110) with a chip attachment location and a third set of contact pads (112) near the location. Low profile bond wires (130) span between the pads of the third set and the second set. A second semiconductor chip (140) of a size has a fourth set of contact pads (141) at locations matching the first set pads. The second chip is placed over the first chip so that the fourth set pads are aligned with the spacers on the matching first set pads, and at least one edge of the second chip overhangs the sphere on at least one pad of the second set.

Abstract: A circuit (100) that drives word lines and tests a word line (102) in a semiconductor device is disclosed. A charge circuit (108) couples a supply voltage (VPP) to a charge node (106) according to a potential at a boot node (110). The charge node (106) supplies a charge voltage for the word line (102). In a standard cycle, the boot node (110) is charged to a high voltage, and maintained at the high potential, to keep the word line (102) charged. In a test cycle, the boot node (110) is charged to a high voltage, and then discharged to a low voltage, thereby isolating the charge node (106) and the word line (102). In the event the word line (102) suffers from current leakage, a drop in potential will be detected at the charge rode (106).

Abstract: A circuit is designed with a detector circuit (700) coupled between a supply voltage terminal (705) and a reference voltage terminal (755). The detector circuit produces a first control signal in response to a detected mode and produces a second control signal in response to another mode. A first circuit (205, 207) including a delay circuit receives the first control signal and a third control signal. The delay circuit produces a fourth control signal at an output terminal (215) in response to the first and third control signals. A second circuit (203) receives the second control signal and the third control signal. The second circuit produces the fourth control signal at the output terminal in response to the second and third control signals.

Abstract: A synchronous random access memory is arranged to be responsive directly to a system clock signal for operating synchronously with the associated microprocessor. The synchronous random access memory is further arranged to either write-in or read out data in a synchronous burst operation or synchronous wrap operation in addition to synchronous random access operations. The synchronous random access memory device may be fabricated as a dynamic storage device or as a static storage device.

Abstract: A read mask circuit (300) is disclosed. A mask command is shifted through a series of mask latches (308 and 310) to generate the output-enable input (OE.sub.--) of an output driver (306). In synchronism with the mask command, data bits are shifted through a series of data latches (312 and 314) to the data input (DIN) of the output driver (306). To prevent a race condition between the mask command and the data bit that is to be masked (B3), the mask command, when latched in the second-to-last mask latch (308), is used to interrupt the last data latch (314). This prevents the to-be-masked data bit (B3) from being latched in the last data latch (314) and generating an undesirable output data transition by the output driver (306).

Abstract: A synchronous random access memory is arranged to be responsive directly to a system clock signal for operating synchronously with the associated microprocessor. The synchronous random access memory is further arranged to either write-in or read out data in a synchronous burst operation or synchronous wrap operation in addition to synchronous random access operations. The synchronous random access memory device may be fabricated as a dynamic storage device or as a static storage device.

Abstract: A synchronous random access memory is arranged to be responsive directly to a system clock signal for operating synchronously with the associated microprocessor. The synchronous random access memory is further arranged to either write-in or read out data in a synchronous burst operation or synchronous wrap operation in addition to synchronous random access operations. The synchronous random access memory device may be fabricated as a dynamic storage device or as a static storage device.

Abstract: A synchronous random access memory is arranged to be responsive directly to a system clock signal for operating synchronously with the associated microprocessor. The synchronous random access memory is further arranged to either write-in or read out data in a synchronous burst operation or synchronous wrap operation in addition to synchronous random access operations. The synchronous random access memory device may be fabricated as a dynamic storage device or as a static storage device.

Abstract: A semiconductor memory device 40 includes an array of storage cells 130, addressable by row and column and specifically designed for testing. Row and column addresses are decoded to access a row and plural columns simultaneously. A test data bit to be written into the storage cells is replicated and stored into as many storage cells at once as there are columns simultaneously accessed. Upon readout for a comparison test, plural occurrences of the stored test data bit are compared with each other and with an expected data bit within parallel comparator circuitry 140 located within the memory device. A pass/fail signal (on lead 170) from the parallel comparator circuitry is transmitted to the memory device tester 30 for final defect analysis and correction. When a failure/defect is detected, information representing the address and the type of failure are stored in the memory device tester. A memory device test method also is described.

Abstract: The invention discloses a high density semiconductor package. Two semiconductor chips are each affixed on a corresponding one of two lead frames. The semiconductor chips and the lead frames are encapsulated, wherein only a portion of the leads of the lead frames protrudes and extends from the package.

Abstract: A synchronous random access memory is arranged to be responsive directly to a system clock signal for operating synchronously with the associated microprocessor. The synchronous random access memory is further arranged to either write-in or read out data in a synchronous burst operation or synchronous wrap operation in addition to synchronous random access operations. The synchronous random access memory device may be fabricated as a dynamic storage device or as a static storage device.

Abstract: A dynamic random access memory part 30 provides a write per bit feature by locating the respective write mask information latches 118 adjacent the respective local I/O buffers 116. The write mask information thus passes through the data latch 108 and across the data path to the local I/O buffer 116 before being latched. This reduces the area otherwise needed for the additional write mask lead, which in a x8, x16, x32 or x64 bit part can be intolerably large.

Abstract: The invention discloses a high density semiconductor package. In one embodiment, two semiconductor chips are each affixed on a corresponding one of two lead frames. The semiconductor chips and the lead frames are encapsulated, wherein only a portion of the leads of the lead frames protrudes and extends from the package.

Abstract: An MOS DRAM memory device includes an output buffer having an N-channel output transistor that must receive a boosted gate signal to produce a full Vdd output high logic level signal at the output terminal. The N-channel transistor connects between the Vdd supply voltage and the output terminal. The output buffer connects a Vdd supply voltage to the gate of the output transistor for a short period sufficient to raise the gate to the Vdd voltage level and then disconnects the Vdd supply. The buffer then connects a Vdd+ supply voltage to the gate to increase the gate voltage at least one transistor threshold value above the Vdd supply voltage. This provides the Vdd voltage at the output terminal.

Abstract: An oscillator (108) for a standby charge pump (102,104)in a dynamic random access memory part (30) includes a fuse (136). The fuse can be blown after testing the part while selecting redundant memory cells to reduce the frequency of the oscillator and obtain a lower power part. The oscillator (108) also drives the on-chip self-refresh circuits (106) that operate slower in response to the reduced frequency. Selecting redundant circuits also includes eliminating memory cells that pass the pause test, but by only a certain margin. Reducing the frequency of the oscillator driving the self-refresh circuits would otherwise cause failure of the cells that pass the pause test by only the certain margin. The oscillator circuit includes a ring of inverter stages (112) and a fused voltage bias circuit (110) generating one or another set of bias voltages (118,120) to the ring oscillator to alter its frequency of oscillation.

Abstract: Switching circuits controlled by a fuse that can be blown after testing the DRAM part select the timing signals coupled from a binary counter to internal signal generator circuits. The internal Circuits control self refresh in this embodiment. The decision to leave the fuse intact or blow the fuse rests on the test results obtained from each part and can vary depending upon maturity of the manufacturing process, the pause test results obtained and whether a low power part is desired. The fuse is affected after fabrication of the chip and at the same time as other fuses used for redundancy. This provides another degree of freedom in the manufacture of integrated circuits.

Abstract: A synchronous random access memory is arranged to be responsive directly to a system clock signal for operating synchronously with the associated microprocessor. The synchronous random access memory is further arranged to either write-in or read out data in a synchronous burst operation or synchronous wrap operation in addition to synchronous random access operations. The synchronous random access memory device may be fabricated as a dynamic storage device or as a static storage device.