Patents by Inventor Duygu Buga

Duygu Buga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260201182
    Abstract: The present invention relates to an electrically conductive composition comprising a) a nitrocellulose resin; b) electrically conductive particles comprising graphite and carbon black, wherein ratio of the graphite and the carbon black is from 1:1 to 5:1; c) a solvent; and d) a di- or multi-functional isocyanate, where in ratio of the electrically conductive particles and the resin is from 0.20:1 to 4:1. The compositions according to the present invention can be used as a structural adhesives or to generate an electrically conductive surface onto a non-conductive substrate.
    Type: Application
    Filed: March 13, 2026
    Publication date: July 16, 2026
    Inventors: Tom Fleck-Kunde, Duygu Buga, Uwe Franken, Frank Goethel, Rudolf Oldenzijl
  • Publication number: 20260193499
    Abstract: The present invention relates to a curable and debondable two-part thermally conductive adhesive composition comprising a first part comprising an epoxy resin; an electrolyte; and a thermally conductive filler; and a second part comprising a curing agent; and a thermally conductive filler, wherein the composition further comprises an electrically conductive filler. The composition according to the present invention can be used in battery modules of electric vehicles. And the composition according to the present invention facilitates faster repair and recycling of battery modules of electric vehicles.
    Type: Application
    Filed: March 2, 2026
    Publication date: July 9, 2026
    Inventors: Tom Fleck-Kunde, Duygu Buga, Stefanie Stapf, Thomas Kamm, Andreas Niegemeier, Lucas Knauf, Philipp Reuther
  • Publication number: 20260088410
    Abstract: The present disclosure is directed to an electronics assembly comprising: a housing having walls which define an enclosure having at least one floored chamber, wherein at least one wall of the housing is provided with an electrically conductive surface which faces into a chamber; n electronic components disposed in the enclosure, wherein n is an integer of at least 2 and wherein at least a fraction of said electronic components are provided with an electrically conductive exterior surface; and, an adhesive by which said electrically conductive exterior surface of said fraction of electronic components is adhered to said electrically conductive surface of wall, wherein the electronics assembly is characterized in that said adhesive is obtained by curing a curable electrochemically debondable adhesive composition comprising: a non-polymerizable electrolyte; a rheology control agent; and, a matrix resin.
    Type: Application
    Filed: December 4, 2025
    Publication date: March 26, 2026
    Inventors: Uwe Franken, Tom Fleck, Duygu Buga, Stefanie Stapf, Thomas Kamm