Abstract: A repair compound for use in all applications and particularly well-suited for large hole repair. The repair compound includes a latex resin, a thickener, fibers, and a filler material. In some embodiments, the repair compound is configured to exhibit pseudoplastic-type behavior. In some embodiments, the repair compound has a density of not greater than 4.0 lbs/gal. In some embodiments, the repair compound includes hydrophobic and hydrophilic fibers of different morphologies. In some embodiments, the repair compound includes HASE-type thickeners. In some embodiments, the repair compound includes a bimodal distribution of hollow glass microspheres from two different strength/size curves.

Abstract: A repair compound for use in all applications and particularly well-suited for large hole repair. The repair compound includes a latex resin, a thickener, fibers, and a filler material. In some embodiments, the repair compound is configured to exhibit pseudoplastic-type behavior. In some embodiments, the repair compound has a density of not greater than 4.0 lbs/gal. In some embodiments, the repair compound includes hydrophobic and hydrophilic fibers of different morphologies. In some embodiments, the repair compound includes HASE-type thickeners. In some embodiments, the repair compound includes a bimodal distribution of hollow glass microspheres from two different strength/size curves.

Abstract: A repair compound for use in all applications and particularly well-suited for large hole repair. The repair compound includes a latex resin, a thickener, fibers, and a filler material. In some embodiments, the repair compound is configured to exhibit pseudoplastic-type behavior. In some embodiments, the repair compound has a density of not greater than 4.0 lbs/gal. In some embodiments, the repair compound includes hydrophobic and hydrophilic fibers of different morphologies. In some embodiments, the repair compound includes HASE-type thickeners. In some embodiments, the repair compound includes a bimodal distribution of hollow glass microspheres from two different strength/size curves.

Abstract: A repair compound for use in all applications and particularly well-suited for large hole repair. The repair compound includes a latex resin, a thickener, fibers, and a filler material. In some embodiments, the repair compound is configured to exhibit pseudoplastic-type behavior. In some embodiments, the repair compound has a density of not greater than 4.0 lbs/gal. In some embodiments, the repair compound includes hydrophobic and hydrophilic fibers of different morphologies. In some embodiments, the repair compound includes HASE-type thickeners. In some embodiments, the repair compound includes a bimodal distribution of hollow glass microspheres from two different strength/size curves.

Abstract: A repair compound for use in all applications and particularly well-suited for large hole repair. The repair compound includes a latex resin, a thickener, fibers, and a filler material. In some embodiments, the repair compound is configured to exhibit pseudoplastic-type behavior. In some embodiments, the repair compound has a density of not greater than 4.0 lbs/gal. In some embodiments, the repair compound includes hydrophobic and hydrophilic fibers of different morphologies. In some embodiments, the repair compound includes HASE-type thickeners. In some embodiments, the repair compound includes a bimodal distribution of hollow glass microspheres from two different strength/size curves.

Abstract: A backing device useful in repairing a hole. In some embodiments, the hole is in a wall, for example a relatively large hole in a wall (e.g., vertical wall, ceiling, etc.) of, for example, a home or building structure. The backing device includes a collapsible backing member and adhesive strips. The backing member defines a front face opposite a rear face, and includes first and second panels connected at a hinge segment. The adhesive strips are disposed on the front face. The backing member is foldable from a flat state to a collapsed state for insertion through the wall hole. Once deployed “behind” the wall, the backing member is transitioned to the flat state, and the adhesive strips utilized to secure the backing device to a back surface of the wall. In some embodiments, the backing device, while in the flat state, is relatively rigid in one direction and collapsible in the opposite direction.

Abstract: A repair compound for use in all applications and particularly well-suited for large hole repair. The repair compound includes a latex resin, a thickener, fibers, and a filler material. In some embodiments, the repair compound is configured to exhibit pseudoplastic-type behavior. In some embodiments, the repair compound has a density of not greater than 4.0 lbs/gal. In some embodiments, the repair compound includes hydrophobic and hydrophilic fibers of different morphologies. In some embodiments, the repair compound includes HASE-type thickeners. In some embodiments, the repair compound includes a bimodal distribution of hollow glass microspheres from two different strength/size curves.

Abstract: A backing device useful in repairing a hole. In some embodiments, the hole is in a wall, for example a relatively large hole in a wall (e.g., vertical wall, ceiling, etc.) of, for example, a home or building structure. The backing device includes a collapsible backing member and adhesive strips. The backing member defines a front face opposite a rear face, and includes first and second panels connected at a hinge segment. The adhesive strips are disposed on the front face. The backing member is foldable from a flat state to a collapsed state for insertion through the wall hole. Once deployed “behind” the wall, the backing member is transitioned to the flat state, and the adhesive strips utilized to secure the backing device to a back surface of the wall. In some embodiments, the backing device, while in the flat state, is relatively rigid in one direction and collapsible in the opposite direction.

Abstract: A backing device useful in repairing a hole. In some embodiments, the hole is in a wall, for example a relatively large hole in a wall (e.g., vertical wall, ceiling, etc.) of, for example, a home or building structure. The backing device includes a collapsible backing member and adhesive strips. The backing member defines a front face opposite a rear face, and includes first and second panels connected at a hinge segment. The adhesive strips are disposed on the front face. The backing member is foldable from a flat state to a collapsed state for insertion through the wall hole. Once deployed “behind” the wall, the backing member is transitioned to the flat state, and the adhesive strips utilized to secure the backing device to a back surface of the wall. In some embodiments, the backing device, while in the flat state, is relatively rigid in one direction and collapsible in the opposite direction.

Abstract: A backing device useful in repairing a hole. In some embodiments, the hole is in a wall, for example a relatively large hole in a wall (e.g., vertical wall, ceiling, etc.) of for example, a home or building structure. The backing device includes a collapsible backing member and adhesive strips. The backing member defines a front face opposite a rear face, and includes first and second panels connected at a hinge segment. The adhesive strips are disposed on the front face. The backing member is foldable from a flat state to a collapsed state for insertion through the wall hole. Once deployed “behind” the wall, the backing member is transitioned to the flat state, and the adhesive strips utilized to secure the backing device to a back surface of the wall. In some embodiments, the backing device, while in the flat state, is relatively rigid in one direction and collapsible in the opposite direction.