Patents by Inventor Dwight DANIELS

Dwight DANIELS has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead frame having redistribution layer
    Patent number: 10381295
    Abstract: Embodiments of a packaged semiconductor device are provided, which includes a flag of a lead frame having a top surface and a bottom surface; a redistribution layer (RDL) structure formed on the top surface of the flag, the RDL structure including a first connection path having a first exposed bonding surface in a top surface of the RDL structure; and a first wirebond connected to the first exposed bonding surface and to a lead of the lead frame.
    Type: Grant
    Filed: September 12, 2017
    Date of Patent: August 13, 2019
    Assignee: NXP USA, Inc.
    Inventors: Michael Vincent, Ryan Hooper, Dwight Daniels
  • LEAD FRAME HAVING REDISTRIBUTION LAYER
    Publication number: 20190080991
    Abstract: Embodiments of a packaged semiconductor device are provided, which includes a flag of a lead frame having a top surface and a bottom surface; a redistribution layer (RDL) structure formed on the top surface of the flag, the RDL structure including a first connection path having a first exposed bonding surface in a top surface of the RDL structure; and a first wirebond connected to the first exposed bonding surface and to a lead of the lead frame.
    Type: Application
    Filed: September 12, 2017
    Publication date: March 14, 2019
    Inventors: Michael VINCENT, Ryan HOOPER, Dwight DANIELS