Patents by Inventor Dyke Shaffer

Dyke Shaffer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9225392
    Abstract: A coil assembly is disclosed. The coil assembly includes a coil that is provided on a substrate. The coil includes a trace element that is wound on the substrate. The trace element includes an interior gap that extends or is present along at least a portion of the trace element. The interior gap is dimensioned to reduce a presence of eddy currents that would otherwise be generated when the coil is active to inductively transmit or receive signals.
    Type: Grant
    Filed: March 9, 2011
    Date of Patent: December 29, 2015
    Assignee: QUALCOMM Incorporated
    Inventors: Michael Lehr, Manjirnath Chatterjee, Dyke Shaffer, Eric Liu
  • Publication number: 20130308256
    Abstract: A coil assembly is disclosed. The coil assembly includes a coil that is provided on a substrate. The coil includes a trace element that is wound on the substrate. The trace element includes an interior gap that extends or is present along at least a portion of the trace element. The interior gap is dimensioned to reduce a presence of eddy currents that would otherwise be generated when the coil is active to inductively transmit or receive signals.
    Type: Application
    Filed: March 9, 2011
    Publication date: November 21, 2013
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Michael Lehr, Manjirnath Chatterjee, Dyke Shaffer, Eric Liu
  • Patent number: 8437695
    Abstract: An inductive signal interface comprises a coil assembly including one or more inductive coils, a bridge circuit including a plurality of switches, and control circuitry. The control circuitry is configured to individually operate the plurality of switches to enable the inductive signal interface to dynamically switch between a power-transmit mode and a power receive mode.
    Type: Grant
    Filed: July 21, 2010
    Date of Patent: May 7, 2013
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Manjirnath Chatterjee, Michael Lehr, Dyke Shaffer
  • Publication number: 20110037321
    Abstract: An inductive signal interface comprises a coil assembly including one or more inductive coils, a bridge circuit including a plurality of switches, and control circuitry. The control circuitry is configured to individually operate the plurality of switches to enable the inductive signal interface to dynamically switch between a power-transmit mode and a power receive mode.
    Type: Application
    Filed: July 21, 2010
    Publication date: February 17, 2011
    Inventors: Manjirnath Chatterjee, Michael Lehr, Dyke Shaffer