Patents by Inventor Dylan C. Erb

Dylan C. Erb has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240097210
    Abstract: A battery pack includes a housing defining a housing interior, a first stack of electrochemical cells disposed in the housing interior, a second stack of electrochemical cells disposed in the housing interior, and an electronics compartment disposed in the housing interior. The electronics compartment is positioned between the first stack of electrochemical cells and the second stack of electrochemical cells. Further, the electronics compartment extends along a majority of a length of the battery pack.
    Type: Application
    Filed: September 21, 2022
    Publication date: March 21, 2024
    Inventors: Nivay Anandarajah, Evan D. Maley, Matthew I Woods, Dylan C. Erb, Abraham B. Caulk, Joseph D. Rainey, John M. Schoech
  • Patent number: 10052824
    Abstract: Systems, devices, and methods for three-dimensional printing are provided. The systems, devices, and methods provide for high throughput printing by allowing for parallel extrusion within a single vertical layer of the printed object, i.e., parallel extrusion within an x-y coordinate plane. Any advancement of an extruder can be limited to movement along a single axis, or even no axis at all, so that printing occurs more quickly. In some embodiments, the extruder can include a printing plate that includes a plurality of apertures defined by conductive elements extending in a grid-like manner. The printer can be designed such that material is disposed to a build platform through the apertures only when the aperture is heated on all four sides, for instance by running current through the conductive elements that define the aperture. Other systems, devices, and methods for three-dimensional printing are also provided.
    Type: Grant
    Filed: May 13, 2015
    Date of Patent: August 21, 2018
    Assignee: Massachusetts Institute of Technology
    Inventors: Dylan C. Erb, Joshua E. Siegel, Isaac M. Ehrenberg, Pranay Jain
  • Publication number: 20150328838
    Abstract: Systems, devices, and methods for three-dimensional printing are provided. The systems, devices, and methods provide for high throughput printing by allowing for parallel extrusion within a single vertical layer of the printed object, i.e., parallel extrusion within an x-y coordinate plane. Any advancement of an extruder can be limited to movement along a single axis, or even no axis at all, so that printing occurs more quickly. In some embodiments, the extruder can include a printing plate that includes a plurality of apertures defined by conductive elements extending in a grid-like manner. The printer can be designed such that material is disposed to a build platform through the apertures only when the aperture is heated on all four sides, for instance by running current through the conductive elements that define the aperture. Other systems, devices, and methods for three-dimensional printing are also provided.
    Type: Application
    Filed: May 13, 2015
    Publication date: November 19, 2015
    Inventors: Dylan C. Erb, Joshua E. Siegel, Isaac M. Ehrenberg, Pranay Jain