Patents by Inventor Dylan C. Erb

Dylan C. Erb has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240339692
    Abstract: A battery pack includes a first busbar, a second busbar, and a thermal interface material (TIM) including a thermal conductivity constant (k) value between 1.0 and 7.0 watts per meter-kelvin (W/mK). The TIM establishes a thermal interface between the first busbar and the second busbar. The battery pack also includes a control assembly configured to regulate a charging mode of the battery pack in which the first busbar is active and receives an electrical current and the second busbar is inactive.
    Type: Application
    Filed: March 8, 2024
    Publication date: October 10, 2024
    Inventors: Dylan C Erb, John M Schoech, Nivay Anandarajah, Alexander Bartlett, Abraham B Caulk, Joseph D Rainey, Berton Vite
  • Publication number: 20240304891
    Abstract: A battery pack includes an enclosure forming an enclosure interior, a stack of battery cells disposed within the enclosure interior, and an adhesive extending between a wall of the enclosure and the stack. The battery pack also includes a first gap filler extending between the wall and the stack, where the first gap filler is disposed adjacent to a first edge of the stack and includes a first thermal conductivity constant greater than a second thermal conductivity constant of the adhesive. The battery pack also includes a second gap filler extending between the wall and the stack, where the second gap filler is disposed adjacent to a second edge of the stack and includes a third thermal conductivity constant greater than the second thermal conductivity constant.
    Type: Application
    Filed: February 7, 2024
    Publication date: September 12, 2024
    Inventors: Edward T Hillstrom, Alexander Bartlett, Nivay Anandarajah, Dylan C Erb, Zhongying Shi
  • Publication number: 20240234909
    Abstract: A battery pack includes an enclosure comprising a first wall and a second wall opposing the first wall, battery cells disposed in an interior of the enclosure between the first wall and the second wall, a first coating and adhesive assembly, and a second coating and adhesive assembly. The first coating and adhesive assembly is configured to structurally couple the battery cells with the first wall of the enclosure and electrically isolate the battery cells from the first wall of the enclosure. The second coating and adhesive assembly is configured to structurally coupling the battery cells with the second wall of the enclosure and electrically isolate the battery cells from the second wall of the enclosure.
    Type: Application
    Filed: January 9, 2023
    Publication date: July 11, 2024
    Inventors: Edward T. Hillstrom, Nivay Anandarajah, Christopher T. Campbell, Dustin Y. Chen, Joseph D. Rainey, Rebecca L. King, Evan D. Maley, Dylan C. Erb
  • Publication number: 20240234895
    Abstract: A battery pack includes an enclosure comprising a first wall and a second wall opposing the first wall, battery cells disposed in an interior of the enclosure between the first wall and the second wall, a first coating and adhesive assembly, and a second coating and adhesive assembly. The first coating and adhesive assembly is configured to structurally couple the battery cells with the first wall of the enclosure and electrically isolate the battery cells from the first wall of the enclosure. The second coating and adhesive assembly is configured to structurally coupling the battery cells with the second wall of the enclosure and electrically isolate the battery cells from the second wall of the enclosure.
    Type: Application
    Filed: October 3, 2023
    Publication date: July 11, 2024
    Inventors: Edward T Hillstrom, Nivay Anandarajah, Christopher T Campbell, Dustin Y Chen, Joseph D Rainey, Dylan C Erb, Rebecca L King, Evan D Maley
  • Publication number: 20240097210
    Abstract: A battery pack includes a housing defining a housing interior, a first stack of electrochemical cells disposed in the housing interior, a second stack of electrochemical cells disposed in the housing interior, and an electronics compartment disposed in the housing interior. The electronics compartment is positioned between the first stack of electrochemical cells and the second stack of electrochemical cells. Further, the electronics compartment extends along a majority of a length of the battery pack.
    Type: Application
    Filed: September 21, 2022
    Publication date: March 21, 2024
    Inventors: Nivay Anandarajah, Evan D. Maley, Matthew I Woods, Dylan C. Erb, Abraham B. Caulk, Joseph D. Rainey, John M. Schoech
  • Patent number: 10052824
    Abstract: Systems, devices, and methods for three-dimensional printing are provided. The systems, devices, and methods provide for high throughput printing by allowing for parallel extrusion within a single vertical layer of the printed object, i.e., parallel extrusion within an x-y coordinate plane. Any advancement of an extruder can be limited to movement along a single axis, or even no axis at all, so that printing occurs more quickly. In some embodiments, the extruder can include a printing plate that includes a plurality of apertures defined by conductive elements extending in a grid-like manner. The printer can be designed such that material is disposed to a build platform through the apertures only when the aperture is heated on all four sides, for instance by running current through the conductive elements that define the aperture. Other systems, devices, and methods for three-dimensional printing are also provided.
    Type: Grant
    Filed: May 13, 2015
    Date of Patent: August 21, 2018
    Assignee: Massachusetts Institute of Technology
    Inventors: Dylan C. Erb, Joshua E. Siegel, Isaac M. Ehrenberg, Pranay Jain
  • Publication number: 20150328838
    Abstract: Systems, devices, and methods for three-dimensional printing are provided. The systems, devices, and methods provide for high throughput printing by allowing for parallel extrusion within a single vertical layer of the printed object, i.e., parallel extrusion within an x-y coordinate plane. Any advancement of an extruder can be limited to movement along a single axis, or even no axis at all, so that printing occurs more quickly. In some embodiments, the extruder can include a printing plate that includes a plurality of apertures defined by conductive elements extending in a grid-like manner. The printer can be designed such that material is disposed to a build platform through the apertures only when the aperture is heated on all four sides, for instance by running current through the conductive elements that define the aperture. Other systems, devices, and methods for three-dimensional printing are also provided.
    Type: Application
    Filed: May 13, 2015
    Publication date: November 19, 2015
    Inventors: Dylan C. Erb, Joshua E. Siegel, Isaac M. Ehrenberg, Pranay Jain