Patents by Inventor Dylan GRACE

Dylan GRACE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Signal control using temperature and resistivity changes in a conductor
    Patent number: 12658343
    Abstract: A signal interconnect system for dynamic overshoot and undershoot damping is provided. The signal interconnect system includes a conductor and a temperature control system. The temperature control system is configured to adjust a temperature and thereby a resistivity of the conductor for dynamically damping overshoot and the undershoot of a signal passed along the conductor.
    Type: Grant
    Filed: March 26, 2024
    Date of Patent: June 16, 2026
    Assignee: International Business Machines Corporation
    Inventors: Thomas W. Liang, Matthew Doyle, Kyle Schoneck, John R. Dangler, Jason J. Bjorgaard, Kevin Daniel Escobar, Alexander Jay Wolseth, Matthew A Walther, Dylan Grace
  • THERMAL RUNAWAY EVENT DETECTION
    Publication number: 20250379274
    Abstract: Thermal runaway event detection includes measuring, using an expansion sensor layered over a battery device, a rate of expansion of the battery device based on time series detections of volumetric expansion by the expansion sensor; detecting, based on the rate of expansion, conditions for a thermal runaway event; and performing a thermal runaway remediation action in response to detecting the conditions for the thermal runaway event.
    Type: Application
    Filed: June 6, 2024
    Publication date: December 11, 2025
    Inventors: LAYNE A. BERGE, DYLAN GRACE, MATTHEW A. WALTHER, KYLE SCHONECK, JOHN R. DANGLER, KEVIN DANIEL ESCOBAR, MATTHEW DOYLE, ALEXANDER JAY WOLSETH, THOMAS W. LIANG
  • Signal Control Using Temperature and Resistivity Changes in a Conductor
    Publication number: 20250308728
    Abstract: A signal interconnect system for dynamic overshoot and undershoot damping is provided. The signal interconnect system includes a conductor and a temperature control system. The temperature control system is configured to adjust a temperature and thereby a resistivity of the conductor for dynamically damping overshoot and the undershoot of a signal passed along the conductor.
    Type: Application
    Filed: March 26, 2024
    Publication date: October 2, 2025
    Inventors: Thomas W. LIANG, Matthew DOYLE, Kyle SCHONECK, John R. DANGLER, Jason J. BJORGAARD, Kevin Daniel ESCOBAR, Alexander Jay WOLSETH, Matthew A. WALTHER, Dylan GRACE