Abstract: A thermal ground plane is disclosed that includes one or more flattened or flattened and deformed mesh disposed within a cavity formed between a top casing and bottom casing. The flattened and deformed mesh, for example, may be created by compressing or flattening mesh such that the pores in the mesh are at least three times smaller than the pores in the mesh prior to flattening. The deformation can be formed to create a plurality of out of plane pillars in the mesh.

Abstract: Some embodiments include a thermal ground plane comprising a first casing layer and a second casing layer where the outer periphery of the first casing layer and the outer periphery of the second casing layer are bonded to each other. The thermal ground plane including a working fluid disposed within the first casing layer and the second casing layer. The thermal ground plane may also include a permeable wick disposed between the first casing layer and the second casing layer; and a deformed mesh disposed between the first casing layer and the permeable wick, the deformed mesh comprising a mesh with deformed mesh portions that form vapor channels and nondeformed mesh portions that form liquid channels.

Abstract: Some embodiments include a thermal ground plane comprising a first casing layer and a second casing layer where the outer periphery of the first casing layer and the outer periphery of the second casing layer are bonded to each other. The thermal ground plane including a working fluid disposed within the first casing layer and the second casing layer. The thermal ground plane may also include a permeable wick disposed between the first casing layer and the second casing layer; and a deformed mesh disposed between the first casing layer and the permeable wick, the deformed mesh comprising a mesh with deformed mesh portions that form vapor channels and nondeformed mesh portions that form liquid channels.

Abstract: Three-dimensional meshes and three-dimensional casings for thermal ground planes are disclosed. These three-dimensional meshes and three-dimensional casings can create a vapor core that has structural resiliency positive or negative pressure differential between the vapor space and external conditions. A thermal ground plane is disclosed that includes a first casing that is substantially planar and a second casing. The outer periphery of the first casing and the outer periphery of the second casing are bonded together to form a hermetic seal. The second casing may be deformed to create a vapor support structure within the thermal ground plane that includes a plurality of deformed portions (or rough pillars). A working fluid may be disposed within the first casing and the second casing. Permeable wicks may also be disposed on an inner surface of the first casing and/or the second casing for liquid transport that is disposed between the first casing and the second casing.

Abstract: Some embodiments include a thermal ground plane comprising a first casing layer and a second casing layer where the outer periphery of the first casing layer and the outer periphery of the second casing layer are bonded to each other. The thermal ground plane including a working fluid disposed within the first casing layer and the second casing layer. The thermal ground plane may also include a permeable wick disposed between the first casing layer and the second casing layer; and a deformed mesh disposed between the first casing layer and the permeable wick, the deformed mesh comprising a mesh with deformed mesh portions that form vapor channels and nondeformed mesh portions that form liquid channels.

Abstract: Some embodiments include a thermal ground plane comprising a first casing layer and a second casing layer where the outer periphery of the first casing layer and the outer periphery of the second casing layer are bonded to each other. The thermal ground plane including a working fluid disposed within the first casing layer and the second casing layer. The thermal ground plane may also include a permeable wick disposed between the first casing layer and the second casing layer; and a deformed mesh disposed between the first casing layer and the permeable wick, the deformed mesh comprising a mesh with deformed mesh portions that form vapor channels and nondeformed mesh portions that form liquid channels.