Patents by Inventor Dyson Day

Dyson Day has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method to reduce residual particulate contamination in CVD and PVD semiconductor wafer manufacturing
    Patent number: 6812156
    Abstract: A method of reducing particulate contamination in a deposition process including providing a semiconductor wafer having a process surface for depositing a deposition layer thereover according to one of a physical vapor deposition (PVD) and a chemical vapor deposition (CVD) process; depositing at least a portion of the deposition layer over the process surface; cleaning the semiconductor wafer including the process surface according to an ex-situ cleaning process to remove particulate contamination including at least one of spraying and scrubbing; and, repeating the steps of depositing and cleaning at least once to include reducing a level of occluded particulates.
    Type: Grant
    Filed: July 2, 2002
    Date of Patent: November 2, 2004
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd
    Inventors: Dyson Day, Mei-Yen Li, Ming-Te More, Hsing-Yuan Chu
  • Method to reduce residual particulate contamination in CVD and PVD semiconductor wafer manufacturing
    Publication number: 20040005787
    Abstract: A method of reducing particulate contamination in a deposition process including providing a semiconductor wafer having a process surface for depositing a deposition layer thereover according to one of a physical vapor deposition (PVD) and a chemical vapor deposition (CVD) process; depositing at least a portion of the deposition layer over the process surface; cleaning the semiconductor wafer including the process surface according to an ex-situ cleaning process to remove particulate contamination including at least one of spraying and scrubbing; and, repeating the steps of depositing and cleaning at least once to include reducing a level of occluded particulates.
    Type: Application
    Filed: July 2, 2002
    Publication date: January 8, 2004
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Dyson Day, Mei-Yen Li, Ming-Te More, Hsing-Yuan Chu