Abstract: A flexible setting type hydraulic joint compound and a method of forming flexible joints. The flexible joint compound of this invention primarily contains 2 to 20 parts by weight of an emulsion polymer having a Tg that is less than about ?40° C., and 22 to 44 parts by weight of total water, based on 100 parts by weight calcium sulfate hemihydrate filler. It can be applied to joints between two adjacent sheets of gypsum board to form a flexible joint that is resistant to cracking.

Abstract: A method for applying pressure sensitive adhesive (PSA) directly to one or both surfaces of carpet underlayment pads in which a liquid PSA polymer composition is first applied as a layer to a release substrate. The polymer layer is dried, forming a dried PSA film on the release substrate. The dried PSA film is then laminated to one or both surfaces of a carpet underlayment pad. Alternately, the film can be encased in a second substrate for storage and future application to a carpet underlayment pad.

Abstract: Mortar formulations comprising a hydraulic cement and a PVOH stabilized acrylic latex or a spray dried redispersible powder made from the PVOH stabilized acrylic latex are disclosed. These include formulations suitable for use as tile mortars, patching mortars, EIFS base coats and grouts. An acrylic latex that, when formulated with hydraulic cement, has performance advantages over other latex resins in mortar, patch and exterior insulation and finishing systems. The spray dried, redispersible acrylic emulsion polymer that, when formulated with hydraulic cement, has comparable or better performance than a liquid latex in mortars and patches.

Abstract: Adhesion of organic polymer-based compositions to substrate surfaces is enhanced by incorporating into such organic polymer-based compositions an effective amount of an admixture comprising at least one phenolic novolak resin, at least one polyepoxide, and an effective amount of at least one crosslinking agent. The organic polymer-based compositions containing the described admixtures are bonded to metal and other substrates over a wide temperature range, including temperatures substantially below the activation temperatures at which prior art adhesion promoters are most effective.