Patents by Inventor E. Mikhail Sagal

E. Mikhail Sagal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6835347
    Abstract: A highly thermally conductive and high strength net-shape moldable molding composition, with a thermal conductivity above 4 W/m° K and a strength of at least 15 ksi includes a polymer base matrix of, by volume, between 30 and 70 percent. A first highly thermally conductive filler of high modulus PITCH-based carbon, by volume, between 15 and 47 percent is provided in the composition that has a relatively high aspect ratio of at least 10:1. Also in the composition mixture is a second high strength filler of PAN-based carbon, by volume, between 10 and 35 percent that has a relatively high aspect ratio of 10:1 or more. Optionally, a third filler material of thermally conductive material with a relatively low aspect ratio of 5:1 or less may be included in the composition, by volume less than 10 percent, to improve the thermal conductivity and strength of the composition.
    Type: Grant
    Filed: September 5, 2003
    Date of Patent: December 28, 2004
    Assignee: Cool Options, Inc.
    Inventors: Kevin A. McCullough, James D. Miller, E. Mikhail Sagal
  • Publication number: 20040251804
    Abstract: A thermally-conductive polymer composition suitable for making molded reflector articles having light-reflecting surfaces is provided. The composition comprises: a) about 20% to about 80% by weight of a base polymer matrix such as polycarbonate; and b) about 20% to about 80% by weight of a thermally-conductive carbon material such as graphite. The composition can be used to make reflector articles such as housings for automotive tail lamps, head lamps, and other lighting fixtures. A method for manufacturing reflector articles is also provided.
    Type: Application
    Filed: June 11, 2003
    Publication date: December 16, 2004
    Applicant: Cool Options, Inc.
    Inventors: Kevin McCullough, James Miller, E. Mikhail Sagal
  • Publication number: 20040252502
    Abstract: A light-emitting diode reflector assembly having a heat pipe and a reflector body is provided. The assembly further includes a mounting member for mounting a circuit board having an array of light-emitting diodes. The mounting member and reflector body are made from a thermally-conductive polymer composition comprising: i) about 20% to about 80% by weight of a base polymer matrix such as polycarbonate; and ii) about 20% to about 80% by weight of a thermally-conductive material such as carbon graphite.
    Type: Application
    Filed: June 11, 2003
    Publication date: December 16, 2004
    Inventors: Kevin McCullough, James Miller, E. Mikhail Sagal
  • Patent number: 6827470
    Abstract: A thermally conductive lamp reflector is provided that dissipates heat from a light source within the reflector. The reflector assembly includes a shell having a metallized layer on its surface. The shell is made from a composition including about 30% to about 80% by volume of a base polymer matrix and about 20% to about 70% by volume of a thermally conductive filler material. The reflector has a thermal conductivity of greater than 3 W/m° K and preferably greater than 22 W/m° K. The reflectors can be used in automotive headlamps, flashlights, and other lighting fixtures. A method of forming the lamp reflector is also provided.
    Type: Grant
    Filed: August 28, 2002
    Date of Patent: December 7, 2004
    Assignee: Cool Optins, Inc.
    Inventors: E. Mikhail Sagal, Kevin A. McCullough, James D. Miller
  • Publication number: 20040226707
    Abstract: The present invention discloses method of manufacturing a net-shape molded elastomeric heat-dissipating device that includes an integrally formed conformable interface surface. A base elastomeric matrix material is loaded with thermally conductive filler and injected into a mold cavity to form the completed device. Further, a layer of thermally conductive pressure sensitive adhesive material is applied to the conformable interface surface to allow the device to be securely fastened to a heat-generating surface. The present invention provides superior sealing and elimination of voids and air gaps that are typically found between the thermal transfer surfaces thereby facilitating enhanced thermal transfer properties.
    Type: Application
    Filed: May 20, 2004
    Publication date: November 18, 2004
    Inventors: E. Mikhail Sagal, Jeffrey Panek, Kevin A. McCullough
  • Publication number: 20040229035
    Abstract: The present invention relates to thermally conductive, elastomeric pads. The pads can be made by injection-molding a thermally conductive composition comprising about 30 to 60% by volume of an elastomer polymer matrix and about 25 to 60% by volume of a thermally conductive filler material. The resultant pads have heat transfer properties and can be used as a thermal interface to protect heat-generating electronic devices.
    Type: Application
    Filed: June 17, 2004
    Publication date: November 18, 2004
    Inventors: E. Mikhail Sagal, Kevin A. McCullough, James D. Miller
  • Patent number: 6710109
    Abstract: A highly thermally conductive and high strength net-shape moldable molding composition, with a thermal conductivity above 4 W/m° K and a strength of at least 15 ksi includes a polymer base matrix of, by volume, between 30 and 70 percent. A first highly thermally conductive filler of high modulus PITCH-based carbon, by volume, between 15 and 47 percent is provided in the composition that has a relatively high aspect ratio of at least 10:1. Also in the composition mixture is a second high strength filler of PAN-based carbon, by volume, between 10 and 35 percent that has a relatively high aspect ratio of 10:1 or more. Optionally, a third filler material of thermally conductive material with a relatively low aspect ratio of 5:1 or less may be included in the composition, by volume less than 10 percent, to improve the thermal conductivity and strength of the composition.
    Type: Grant
    Filed: July 11, 2001
    Date of Patent: March 23, 2004
    Assignee: Cool Options, Inc. a New Hampshire Corp.
    Inventors: Kevin A. McCullough, James D. Miller, E. Mikhail Sagal
  • Patent number: 6685855
    Abstract: A method of making a thermally-conductive casing for an optical head in a disc player is provided. The method involves molding a polymer composition comprising: i) about 20% to about 80% by weight of a polymer matrix such as polyphenylene sulfide, and ii) about 20% to about 80% by weight of a thermally-conductive material such as carbon graphite into a casing for the optical head. A reinforcing material, such as glass, and other additives, such as flame retardants, can be incorporated into the polymer composition.
    Type: Grant
    Filed: June 11, 2003
    Date of Patent: February 3, 2004
    Assignee: Cool Options, Inc.
    Inventors: James Miller, Kevin McCullough, E. Mikhail Sagal
  • Patent number: 6681487
    Abstract: The present invention discloses a method of constructing a heat pipe that includes providing a heat pipe with phase change media therein and injection overmolding the heat pipe with a conductive composition. The thermally conductive composition absorbs or reflects electro magnetic interference waves and prevents their transmission into and through the heat pipe to the electronic components being cooled by the heat pipe.
    Type: Grant
    Filed: April 16, 2002
    Date of Patent: January 27, 2004
    Assignee: Cool Options, Inc.
    Inventors: E. Mikhail Sagal, Kevin A. McCullough, James D. Miller
  • Publication number: 20030236335
    Abstract: A thermally-conductive plastic substrate for supporting electronic circuits is provided. The substrate has a relatively low dielectric constant and good mechanical strength. The substrate is made from a polymer composition comprising a base polymer matrix and a thermally-conductive, electrically-insulating material. The composition can comprise polyphenylene sulfide and boron nitride. The composition can further comprise a reinforcing material such as glass. The invention also encompasses methods for making such substrates.
    Type: Application
    Filed: May 12, 2003
    Publication date: December 25, 2003
    Inventors: James D. Miller, E. Mikhail Sagal, Kevin A. McCullough
  • Publication number: 20030220432
    Abstract: A thermoplastic, thermally-conductive composition is provided. The composition comprises a base thermoplastic elastomer matrix, thermally-conductive filler material, and temperature-activated phase change material. The composition can be used to make shaped, thermally-conductive articles. The articles can be used as thermal interfaces for dissipating heat from heat-generating devices such as electronic parts. The articles can have good electrical conductivity.
    Type: Application
    Filed: April 8, 2003
    Publication date: November 27, 2003
    Inventors: James Miller, Kevin A. McCullough, E. Mikhail Sagal, Jeffrey Panek
  • Patent number: 6651732
    Abstract: A composite heat dissipation assembly having a net shape injection molded thermally conductive elastomeric heat sink and at least one integral heat pipe is provided in the present invention. The molded conformable heat sink is formed from a base elastomeric material that is loaded with thermally conductive filler. The base material is mixed with the filler and net shape molded to form the outer geometry of the assembly. Within the geometry of the part an integral channel is formed that is capable of receiving a heat pipe. The channel is formed to have an opening that is slightly smaller than the outer cross-sectional dimensions of the heat pipe. When the heat pipe is pressed into the channel a portion of the elastomeric material is compressed and the reactionary force of the compressed material firmly presses the elastomer into thermal communication with the outer surface of the heat pipe.
    Type: Grant
    Filed: August 26, 2002
    Date of Patent: November 25, 2003
    Assignee: Cool Shield, Inc.
    Inventor: E. Mikhail Sagal
  • Patent number: 6649108
    Abstract: A method of manufacturing a net-shape moldable U-shaped heat sink assembly includes injection molding a thermally conductive polymer composite material. The method includes forming a heat sink assembly base member with a number of integrated fins members thereon. A right upstanding wall extends from a first side of the base member and a left upstanding wall extends from a second side of the base member to form a substantially U-shaped heat sink assembly. To enhance thermal conductivity, fins members may be integrally formed into the base member, right wall and/or left wall during the molding of the heat sink assembly. Also, a flexible metallic substrate or hinges may be embedded within the U-shaped heat sink assembly to permit positioning of the right wall and left wall relative to the base member for custom configuration of the heat sink assembly.
    Type: Grant
    Filed: December 7, 2001
    Date of Patent: November 18, 2003
    Assignee: Cool Shield, Inc.
    Inventors: Kevin A. McCullough, E. Mikhail Sagal
  • Publication number: 20030199082
    Abstract: A thermally-conductive biological assay tray is provided. The trays are made from a polymer composition comprising a base polymer matrix and a thermally-conductive material. The trays can be used for fluorescent immunoassays. The fluorescence level of the polymer composition is sufficiently low such that it does not interfere with the fluorescent immunoassay process. The invention also includes methods for making the bioassay trays.
    Type: Application
    Filed: April 8, 2003
    Publication date: October 23, 2003
    Inventors: James Miller, E. Mikhail Sagal, Kevin McCullough
  • Patent number: 6620497
    Abstract: A thermally conductive and electrically insulative polymer composition and a method for creating the same is provided. Thermally conductive filler material is coated with a thermally conductive and electrically insulative coating material and mixed with a base polymer matrix. The mixture is molded into the desired shape. The electrically insulative coating material prevents the transfer of electricity through the filler material thus resulting in an electrically insulative composition.
    Type: Grant
    Filed: January 10, 2001
    Date of Patent: September 16, 2003
    Assignee: Cool Options, Inc.
    Inventors: Lyle James Smith, E. Mikhail Sagal, James D. Miller, Kevin McCullough
  • Patent number: 6620366
    Abstract: The present invention provides an improved electrolytic capacitor device and a method of constructing the same. The capacitor includes a central support post that is inserted into an arbor hole in the center of the active element. The present invention provides a capacitor post that has a core material of metal or thermally conductive polymer that has an outer protective layer formed thereon. The outer protective layer is net shape insert molded over the core using a thermally conductive, electrically insulative polymer material that protects the support core from interfering with the electrical operation of the capacitor while increasing the capacitor's ability to transfer waste heat from the active element to the exterior of the device. The outer layer further includes an integrally formed thermal transfer pad that resides adjacent to the outer can of the capacitor when the capacitor post is installed.
    Type: Grant
    Filed: December 21, 2001
    Date of Patent: September 16, 2003
    Assignee: Cool Options, Inc.
    Inventor: E. Mikhail Sagal
  • Patent number: 6611660
    Abstract: An electric heater element, that is injection overmolded with a thermally conductive polymer having a thermal conductivity of at least 3 W/m° K, includes surface enhancements to increase the overall outer surface area of the element that is in contact with a fluid to be heated, thereby enhancing the efficiency of heat transfer into the fluid. The heater element has a solid core having a resistance heating element spirally wound about its outer surface. An outer covering is injection overmolded onto the core sealing the heating element and shielding it from the exterior environment. While the outer covering seals the heating element it also includes surface enhancements such as concentric fins, pins or discs that increase the contact surface area of the outer cover, further enhancing the heat transfer properties of the heating element.
    Type: Grant
    Filed: April 30, 2002
    Date of Patent: August 26, 2003
    Assignee: Cool Options, Inc. a New Hampshire corp.
    Inventor: E. Mikhail Sagal
  • Publication number: 20030139510
    Abstract: A polymer composition having high thermal conductivity and dielectric strength is provided. The polymer composition comprises a base polymer matrix and a thermally-conductive, electrically-insulating material. A reinforcing material such as glass can be added to the composition. The polymer composition can be molded into packaging assemblies for electronic devices such as capacitors, transistors, and resistors.
    Type: Application
    Filed: November 13, 2002
    Publication date: July 24, 2003
    Inventors: E. Mikhail Sagal, Kevin McCullough, James D. Miller
  • Patent number: 6585039
    Abstract: The present invention discloses a heat pipe construction that includes a heat pipe with phase change media therein with a conductive composition molded about the heat pipe. The thermally conductive composition absorbs or reflects electro magnetic interference waves and prevents their transmission into and through the heat pipe to the electronic components being cooled by the heat pipe.
    Type: Grant
    Filed: January 31, 2001
    Date of Patent: July 1, 2003
    Assignee: Cool Options, Inc.
    Inventors: E. Mikhail Sagal, Kevin A. McCullough, James D. Miller
  • Patent number: 6587330
    Abstract: The present invention provides an improved electrolytic capacitor device and a method of constructing the same. The capacitor includes a central support post that is inserted into an arbor hole in the center of the active element. The present invention provides a capacitor post that has a core material of metal or thermally conductive polymer that has an outer protective layer formed thereon. The outer protective layer is net shape insert molded over the core using a thermally conductive, electrically insulative polymer material that protects the support core from interfering with the electrical operation of the capacitor while increasing the capacitor's ability to transfer waste heat from the active element to the exterior of the device. The outer layer further includes an integrally formed thermal transfer pad that resides adjacent to the outer can of the capacitor when the capacitor post is installed.
    Type: Grant
    Filed: November 14, 2002
    Date of Patent: July 1, 2003
    Assignee: Cool Options, Inc.
    Inventor: E. Mikhail Sagal