Patents by Inventor E. Thomas Severn

E. Thomas Severn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Land grid array socket for use with integrated circuit modules of different sizes including modules which are larger than the socket
    Patent number: 5702256
    Abstract: A socket for coupling one of a first integrated circuit module having a first footprint and a first terminal array, or a second integrated circuit module having a second larger footprint to a printed circuit board. A socket base has a top surface for receiving one of the first and second integrated circuit modules and a bottom surface adapted to be mounted on a printed circuit board. A first array of contacts extends transversely through the base from the top surface to the bottom surface for electrically coupling the first terminal array to the printed circuit board. An alignment feature coupled to the base, is configured to align one of the first or second integrated circuit modules within the socket base such that the terminals of either the first or second integrated circuit modules engage the contact array, the second integrated circuit module extending beyond the alignment feature when aligned in the socket.
    Type: Grant
    Filed: December 28, 1995
    Date of Patent: December 30, 1997
    Assignee: Intel Corporation
    Inventor: E. Thomas Severn