Patents by Inventor Ea-Si Lee

Ea-Si Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8018721
    Abstract: An electronic device including a circuit board and a heat dissipating module is provided. The circuit board has a thermal source. The heat dissipating module is disposed on the thermal source and has a heat conducting unit, a first heat dissipating unit and a second heat dissipating unit. The heat conducting unit has a heat conducting plate and a heat pipe. A first surface of the heat conducting plate contacts the thermal source. A first end of the heat pipe is connected to the heat conducting plate. The first heat dissipating unit is connected to a second end of the heat pipe. The second heat dissipating unit is movably disposed on a second surface of the heat conducting plate. The heat dissipating module in the invention can achieve the dual thermal dissipation efficiency via the different cooling modes so as to satisfy the heat dissipating requirement of high speed processors.
    Type: Grant
    Filed: November 24, 2009
    Date of Patent: September 13, 2011
    Assignee: Asustek Computer Inc.
    Inventors: Chin-Lien Chang, Ya-Chyi Chou, Ea-Si Lee, Perng-Kae Wang
  • Publication number: 20100142147
    Abstract: An electronic device including a circuit board and a heat dissipating module is provided. The circuit board has a thermal source. The heat dissipating module is disposed on the thermal source and has a heat conducting unit, a first heat dissipating unit and a second heat dissipating unit. The heat conducting unit has a heat conducting plate and a heat pipe. A first surface of the heat conducting plate contacts the thermal source. A first end of the heat pipe is connected to the heat conducting plate. The first heat dissipating unit is connected to a second end of the heat pipe. The second heat dissipating unit is movably disposed on a second surface of the heat conducting plate. The heat dissipating module in the invention can achieve the dual thermal dissipation efficiency via the different cooling modes so as to satisfy the heat dissipating requirement of high speed processors.
    Type: Application
    Filed: November 24, 2009
    Publication date: June 10, 2010
    Applicant: ASUSTEK COMPUTER INC.
    Inventors: Chin-Lien Chang, Ya-Chyi Chou, Ea-Si Lee, Perng-Kae Wang
  • Patent number: 7575342
    Abstract: A backlight module including a light box and a plurality of lamps in the light box is provided. The light box includes a bottom plate and an opening above the bottom plate. The lamp is disposed at an angle to the bottom plate of the light box. A liquid crystal display including the above backlight module and a liquid crystal panel is further provided. The backlight module provides the plane light source for display.
    Type: Grant
    Filed: May 25, 2006
    Date of Patent: August 18, 2009
    Assignee: Chunghwa Picture Tubes, Ltd.
    Inventors: Yi-Wen Lin, Chih-Chie Chen, Ea-Si Lee
  • Publication number: 20070274064
    Abstract: The invention is directed towards a backlight module including a light box and a plurality of lamps in the light box. The light box includes a bottom plate and an opening above the bottom plate. The lamp is disposed at an angle to the bottom plate of the light box. The present invention further provides a liquid crystal display including the above backlight module and a liquid crystal panel. The backlight module provides the plane light source for display. By using the backlight module of this invention, uniform plane light source is provided and display quality of the liquid display panel is enhanced.
    Type: Application
    Filed: May 25, 2006
    Publication date: November 29, 2007
    Inventors: Yi-Wen Lin, Chih-Chie Chen, Ea-Si Lee