Abstract: Use of a sealing material which is a multifilament or spun yarn coated with a joint sealing composition to seal a joint in a pipe system in which system a fluid having corrosion inhibitors such as diammonium dimolybdate or benzotriazole; and/or sludge removers; and/or an alcohol such as propane diol, or ethylene glycol; and/or a hydrocarbon such as diesel, including biodiesel, fuel oil, or hydraulic oil; and/or steam at a temperature of at least 180° C. and a pressure of at least 10 bar (1000 kPa); is to be passed through the sealed joint. It is surprising that the sealing materials of the invention can maintain a sealed joint despite exposure to such materials.

Abstract: A sealant material for sealing threaded pipe joints that is a multifilament or spun polyphenylene sulfide yarn and a joint sealing composition comprising a silicone oil or a natural oil with a smoke point of about 230° C. or higher. The polyphenylene sulfide yarn is coated with the joint sealant composition. The material forms an effective seal and is resistant even when used in systems in which it is exposed to temperatures in excess of 280° C. The material may be provided in a dispenser.

Abstract: Use of a sealing material which is a multifilament or spun yarn coated with a joint sealing composition to seal a joint in a pipe system in which system a fluid having corrosion inhibitors such as diammonium dimolybdate or benzotriazole; and/or sludge removers; and/or an alcohol such as propane diol, or ethylene glycol; and/or a hydrocarbon such as diesel, including biodiesel, fuel oil, or hydraulic oil; and/or steam at a temperature of at least 180° C. and a pressure of at least 10 bar (1000 kPa); is to be passed through the sealed joint. It is surprising that the sealing materials of the invention can maintain a sealed joint despite exposure to such materials.

Abstract: A curable composition for forming anisotropically conductive bonds comprising: (i) an amount of first substantially uncured curable component; (ii) conductive particles coated with a substantially uniformly thick coating of the cure product of a second curable component dispersed within the first curable cyanoacrylate component. The composition is suitable for use as an adhesive composition for bonding chips to electronic circuits. Desirably the first component and the second component are both cyanoacrylates.

Abstract: The present invention is directed to a photocurable composition for use as an encapsulant, for underfill or attachment adhesives, capable of curing at wavelengths greater than 290 nm. Reaction products of these photocurable compositions have a low level of extractable halide ion, such as less than 100 ppm. In use, the photocurable composition may be applied, for instance, over the wire bonds that electrically connect a semiconductor device to a substrate to maintain a fixed positional relationship and protect the integrity of the electrical connection from vibrational and shock disturbances, as well as from interference from environmental contaminants.

Abstract: The present invention is directed to a photocurable composition for use as in particular an encapsulant, capable of curing at wavelengths greater than 290 nm. Reaction products of these photocurable compositions are opaque but good CTV is achieved. The composition is initially substantially transparent but becomes opaque on exposure to uv. The composition cures while the colour change takes place. In use, the photocurable composition may be applied, for instance, over the wire bonds that electrically connect a semiconductor device to a substrate to maintain a fixed positional relationship and protect the integrity of the electrical connection from vibrational and shock disturbances, as well as from interference from environmental contaminants.