Patents by Inventor Earl C. Williams

Earl C. Williams has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Premature breakage resistant semiconductor wafer and method for the manufacture thereof
    Patent number: 3997964
    Abstract: Disclosed is a breakage resistant semiconductor wafer and a method for the fabrication thereof. Intersecting grooves are formed on one side of the wafer to facilitate ultimate subdivision thereof. A portion, such as a peripheral portion, of the wafer remains ungrooved. The ungrooved portion substantially increases the strength of the wafer and prevents premature breakage. When it is desired to subdivide the wafer, laser scribe lines are formed on the opposite side of the wafer in registry with the grooves. In an alternate embodiment the second side of the wafer is also grooved. However, the grooves on the second side of the wafer traverse the entirety thereof.
    Type: Grant
    Filed: September 30, 1974
    Date of Patent: December 21, 1976
    Assignee: General Electric Company
    Inventors: George F. Holbrook, Bernard R. Tuft, Earl C. Williams