Abstract: A process and solution is disclosed for removing resin bleed from leads of an encapsulated electronic component in which the component is positioned in an aqueous bath having dissolved therein glycerol and a phosphate salt selected from the group consisting of an alkali metal or ammonium phosphate, polyphosphate or pyrophosphate salt. The component is cathodically connected in an electric circuit enabling electrical current to pass through said component.

Abstract: Non-cyanide alkaline aqueous solutions for stripping non-ferrous metals, especially copper, from ferrous metal such as, for example, steel. The stripper solution comprises a water-soluble nitrate, a water-soluble compound of the formula ##EQU1## wherein R represents a valence bond, --CH.sub.2).sub.x wherein x is an integer of 1 to 2, ##EQU2## WHEREIN Y IS AN INTEGER OF 1 TO 2, OR ##EQU3## and M is a compatible, hydrophilic, i.e. water-loving or water-solubilizing, cation, a water-soluble persulfate, a water-soluble urea compound, and ammonium hydroxide. Brass, cadmium and zinc can also be stripped from steel by the stripper or dissolving solutions herein.

Abstract: Surfaces intended to be electrolessly metal plated, for instance the surfaces of through holes on through hole printed circuit boards, are treated with a colloidal catalyst metal-free acid liquid solution of a soluble, lower alkanol-modified noble metal-tin chloride complex until the surface is rendered catalytic. The noble metal of the complex is a noble metal which is catalytic to the deposition of the metal destined to be electrolessly plated on the surface.