Abstract: A method of manufacturing a corrugated copper microwave waveguide comprising placing a mandrel with external corrugations in an electrolyte bath substantially devoid of brighteners, accelerators, or levelers and including copper ions, sulfuric acid, chloride, and polyethylene glycol. The mandrel is placed proximate a copper anode in the bath. One or more waveforms are applied to the mandrel and anode to control electrodeposition distribution of copper to the mandrel rather than controlling the electrolyte bath chemistry. The mandrel and the resulting electroformed waveguide are removed from the electrolyte bath and the mandrel is excised (e.g., dissolved) resulting in a microwave waveguide with internal corrugations. Substantially devoid of additives (brighteners, accelerators, and/or levelers) generally means not having to repeatedly meter in additives during the electroforming process.

Abstract: A method of and system for surface finishing an additive manufactured part. A part having a surface roughness with macroasperities is placed in a chamber with an electrolyte and an electrode. A pulse/pulse reverse power supply is connected to the part rendering it anodic and connected to the electrode rendering it cathodic.

Abstract: A method of coating a substrate, the method comprises adding a nanocarbon material to an electrophoretic solution in an electrophoretic deposition apparatus including the substrate and an electrode spaced from the substrate, and applying a current to the substrate and the electrode to deposit the nanocarbon material onto the substrate.

Abstract: The problem of high rate electrodeposition of metals such as copper during electrowinning operations or high rate charging of lithium or zinc electrodes for rechargeable battery applications while avoiding the adverse effects of dendrite formation such as causing short-circuiting and/or poor deposit morphology is solved by pulse reverse current electrodeposition or charging whereby the forward cathodic (electrodeposition or charging) pulse current is “tuned” to minimize dendrite formation for example by creating a smaller pulsating boundary layer and thereby minimizing mass transport effects leading to surface asperities and the subsequent reverse anodic (electropolishing) pulse current is “tuned” to eliminate the micro- and macro-asperities leading to dendrites.

Abstract: The problem of high rate electrodeposition of metals such as copper during electrowinning operations or high rate charging of lithium or zinc electrodes for rechargeable battery applications while avoiding the adverse effects of dendrite formation such as causing short-circuiting and/or poor deposit morphology is solved by pulse reverse current electrodeposition or charging whereby the forward cathodic (electrodeposition or charging) pulse current is “tuned” to minimize dendrite formation for example by creating a smaller pulsating boundary layer and thereby minimizing mass transport effects leading to surface asperities and the subsequent reverse anodic (electropolishing) pulse current is “tuned” to eliminate the micro- and macro-asperities leading to dendrites.

Abstract: The problem of high rate electrodeposition of metals such as copper during electrowinning operations or high rate charging of lithium or zinc electrodes for rechargeable battery applications while avoiding the adverse effects of dendrite formation such as causing short-circuiting and/or poor deposit morphology is solved by pulse reverse current electrodeposition or charging whereby the forward cathodic (electrodeposition or charging) pulse current is “tuned” to minimize dendrite formation for example by creating a smaller pulsating boundary layer and thereby minimizing mass transport effects leading to surface asperities and the subsequent reverse anodic (electropolishing) pulse current is “tuned” to eliminate the micro- and macro-asperities leading to dendrites.

Abstract: A method of and system for surface finishing an additive manufactured pint. A part having a surface roughness with macroasperities is placed in a chamber with an electrolyte and an electrode. A pulse/pulse reverse power supply is connected to the part rendering it anodic and connected to the electrode rendering it cathodic.

Abstract: A method of and system for surface finishing an additive manufactured part. A part having a surface roughness with macroasperities is placed in a chamber with an electrolyte and an electrode. A pulse/pulse reverse power supply is connected to the part rendering it anodic and connected to the electrode rendering it cathodic.

Abstract: A method of plating a workpiece, the method includes electrochemically removing any oxide on the surface of the workpiece by applying a first waveform to the workpiece and a cathode both placed in a first electrolyte solution, and electroplating the workpiece surface by applying a second waveform to the workpiece and an anode both placed in a second electrolyte solution including a plating material.

Abstract: A method of and system for surface finishing an additive manufactured part. A part having a surface roughness with macroasperities is placed in a chamber with an electrolyte and an electrode. A pulse/pulse reverse power supply is connected to the part rendering it anodic and connected to the electrode rendering it cathodic.

Abstract: The problem of high rate electrodeposition of metals such as copper during electrowinning operations or high rate charging of lithium or zinc electrodes for rechargeable battery applications while avoiding the adverse effects of dendrite formation such as causing short-circuiting and/or poor deposit morphology is solved by pulse reverse current electrodeposition or charging whereby the forward cathodic (electrodeposition or charging) pulse current is “tuned” to minimize dendrite formation for example by creating a smaller pulsating boundary layer and thereby minimizing mass transport effects leading to surface asperities and the subsequent reverse anodic (electropolishing) pulse current is “tuned” to eliminate the micro- and macro-asperities leading to dendrites.