Abstract: A fabrication technique for monolithic microwave integrated circuits employs silicon-on-sapphire wafers. Active and passive elements are formed together in a series of implant and deposition steps. Electrically isolated islands of semiconductor material are defined upon the substrate. Multiple metallization deposits are employed to simultaneously interconnect the individual circuit elements and form passive elements upon the integrated circuit. The technique allows mass production of integrated circuits with considerable raw material savings.

Abstract: Several methods are disclosed for forming an air gap between crossing thin film conductors utilized to interconnect electronic components on a substrate. Each of the methods involves the use of photolithographic techniques to form overpassing conductors on a support material covering the overpassed conductors, followed by removal of the support material. Both deposition and plating techniques are described for forming the overpassing conductors.