Abstract: A sensor apparatus has a substrate and a spectrally selective detection system, and a cover. The spectrally sensitive detection system is sandwiched between the substrate and the cover. The spectrally selective detection system includes a generally laminar array of wavelength selectors optically coupled to a corresponding array of optical detectors located within the substrate. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

Abstract: A sensor apparatus has a substrate and a spectrally selective detection system, and a cover. The spectrally sensitive detection system is sandwiched between the substrate and the cover. The spectrally selective detection system includes a generally laminar array of wavelength selectors optically coupled to a corresponding array of optical detectors located within the substrate. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

Abstract: A process condition measuring device and a handling system may be highly integrated with a production environment where the dimensions of the process condition measuring device are close to those of a production substrate and the handling system is similar to a substrate carrier used for production substrates. Process conditions may be measured with little disturbance to the production environment. Data may be transferred from a process condition-measuring device to a user with little or no human intervention.

Abstract: A process condition measuring device has electronic components sandwiched between two conductive substrate portions. The conductive substrate portions are joined by an electrically conductive pathway. Native oxide is removed from substrate portions and electrically conductive contact pads are formed that are then joined together with electrically conductive adhesive to form the electrically conductive pathway. Sensors may be located on the exterior of the process condition measuring device with conductive leads extending to shielded electronic components.

Abstract: A process condition measuring device has electronic components sandwiched between two conductive substrate portions. The conductive substrate portions are joined by an electrically conductive pathway. Native oxide is removed from substrate portions and electrically conductive contact pads are formed that are then joined together with electrically conductive adhesive to form the electrically conductive pathway.

Abstract: A process condition measuring device and a handling system may be highly integrated with a production environment where the dimensions of the process condition measuring device are close to those of a production substrate and the handling system is similar to a substrate carrier used for production substrates. Process conditions may be measured with little disturbance to the production environment. Data may be transferred from a process condition-measuring device to a user with little or no human intervention.

Abstract: A process condition measuring device and a handling system may be highly integrated with a production environment where the dimensions of the process condition measuring device are close to those of a production substrate and the handling system is similar to a substrate carrier used for production substrates. Process conditions may be measured with little disturbance to the production environment. Data may be transferred from a process condition-measuring device to a user with little or no human intervention.

Abstract: A method of producing fluids from a subterranean formation through a single well in a network of separate well-bores, comprising the steps of: forming a well having a horizontal section located within the formation; completing and equipping such well to produce fluids from the formation; producing fluids from the formation through such well; forming at least one additional well having a horizontal section located within the formation such that such well is in fluid communication with the first well, without intersecting with the horizontal section of the first well, and using such additional well as an conduit within the formation to allow and cause fluids contained in the formation which drain or flow into the horizontal section of such additional well-bore, to flow to and be produced through the first well-bore.

Abstract: In an apparatus for removing material from an article, such as an exposed surface of an intermediate integrated circuit structure, by planarizing, polishing, etching or the like, a sensor is mechanically coupled to a moving carrier of the article for directing through the article to its first side an electromagnetic radiation beam having a wavelength band to which the structure is substantially transparent. The beam is detected after interacting with the article, such as being reflected from its exposed surface, and resulting information of the state of the processing of the exposed surface is transmitted from the moving carrier to a stationary receiver by radiation without the use of any physical transmission media such as wires or optical fibers. Multiple sensors mounted on the moving article carrier provide information of the uniformity of the processing across the exposed article surface.

Abstract: An automatic gain control technique integrates samples of an incoming analog signal a controlled amount of time so that the magnitudes of the samples lie within the desired input window of an analog-to-digital converter or other signal processing device. The values of the samples are then determined from a combination of the output of the signal processing device and their integration time. This is utilized in a system for determining the temperature of a surface of an object, without contacting the surface, by measuring the level of its infra-red radiation emission. A particular application of the system is to measure the temperature of a semiconductor wafer within a processing chamber while forming integrated circuits on it. The measuring system is configured on a single printed circuit board with an extra height metal heat sink structure to which a cooling unit is mounted.

Abstract: A method of producing hydrocarbons from a subterranean formation comprising the steps of: forming a well having a horizontal section located between the midpoint and the bottom of the formation and having a raised end; and continuously injecting a fluid through said raised end to induce hydrocarbons to flow towards the horizontal section in response to gravity drainage while continuously producing hydrocarbons through the horizontal section of the well-bore, so that the injection of fluids occurs simultaneously with the production of hydrocarbons.

Abstract: An automatic gain control technique integrates samples of an incoming analog signal a controlled amount of time so that the magnitudes of the samples lie within the desired input window of an analog-to-digital converter or other signal processing device. The values of the samples are then determined from a combination of the output of the signal processing device and their integration time. This is utilized in a system for determining the temperature of a surface of an object, without contacting the surface, by measuring the level of its infra-red radiation emission. A particular application of the system is to measure the temperature of a semiconductor wafer within a processing chamber while forming integrated circuits on it. The measuring system is configured on a single printed circuit board with an extra height metal heat sink structure to which a cooling unit is mounted.

Abstract: A single channel electronic system for measuring a parameter, such as temperature, by a single sensor or multiple sensors that each include luminescent material. A parameter dependent characteristic, such as decay time, of the sensor's luminescence radiation emitted in response to appropriate excitation, such as in the form of a pulse, is measured. Automatic gain control is provided by adjusting the duration of the excitation radiation pulses instead of their intensities. An undesired effect of excitation radiation directly striking the photodetector is minimized by subtracting a compensating signal from the photodetector output signal, that compensating signal being provided through a compensating photodetector connected in series with the luminescence receiving photodetector.

Abstract: A system for measuring a parameter, such as temperature, by multiple sensors that include luminescent material. A parameter dependent characteristic, such as decay time, of each sensor's luminescence radiation emitted in response to appropriate excitation, such as in the form of a pulse, is measured. Automatic gain control is provided by adjusting the duration of the excitation radiation pulses instead of their intensities. An undesired effect of excitation radiation directly striking the photodetector is minimized by subtracting a compensating signal from the photodetector output signal, that compensating signal being provided through a compensating photodetector connected in series with the luminescence receiving photodetector. Multiple sensors are handled by the electronic system through time division multiplexing, separate photodetectors provided for the sensors being connected in parallel while their associated sensors are excited to luminescence one at a time.

Abstract: A luminescence-based integrated optical and electronic system for measuring temperature or some other parameter from the decay time of a luminescent sensor is disclosed. A high bandwidth, low noise amplifier applies a detected decaying luminescent signal to a digital system that acquires that signal and processes it in order to determine its decay time characteristics that are related to temperature or another parameter being measured. The digital signal processing includes use of a digital curve-fitting technique. A preferred luminescent material for temperature measurement is a chromium-doped yttrium gallium garnet material. The entire optical and electronic portions of the measuring system can be accommodated on a small single circuit card.

Abstract: A luminescence-based integrated optical and electronic system for measuring temperature or some other parameter from the decay time of a luminescent sensor is disclosed. A high bandwidth, low noise amplifier applies a detected decaying luminescent signal to a digital system that acquires that signal and processes it in order to determine its decay time characteristics that are related to temperature or another parameter being measured. The digital signal processing includes use of a digital curve-fitting technique. A preferred luminescent material for temperature measurement is a chromium-doped yttrium gallium garnet material. The entire optical and electronic portions of the measuring system can be accommodated on a small single circuit card.

Abstract: Heat sensitive sensors, such as charge coupled devices which must be cooled to reduce dark current leakage, are packaged in a chip carrier and in contact with the cold surface of an electrothermal cooler the warm opposite surface of which contacts the floor of the carrier to heat the carrier body and the window of the chip carrier to prevent fogging of the cover glass while the sensor remains cold.

Abstract: A system for transfering discs, such as integrated circuit wafers during manufacture, from a location at atmospheric pressure into a vacuum chamber of an electron microscope or the like with a minimum of vacuum loss to the chamber. A wafer is placed on a moveable holder in a small sealable chamber having a sealable top door and which is mounted to the outer surface of the vacuum chamber at the position of a small gate through the chamber wall. The wafer holder carries a magnet that is magnetically coupled to a second magnet outside of the sealable chamber and which is motor driven to transfer the wafer through the gate and into the vacuum chamber and upon a stage that has a three-point grasping mechanism operated by the leading end of the moving wafer holder. The wafer holder includes a solenoid operated clip that engages the leading edge of a wafer during pick-up of the wafer for its removal from the vacuum chamber.