Abstract: A thin-film metal conductor system using a zirconium adhesion layer is disclosed. The system is formed by first plating a layer of zirconium over a substrate material and any electrical components, such as resistors, which are fixed on the substrate. A conductive layer is then deposited over those portions of the zirconium layer which are to provide conductive pathways. The resulting unit is thermally treated in an oxidizing environment, such as air, to oxidize the exposed portions of the zirconium layer and thereby form regions of zirconium oxide. The zirconium oxide is nonconductive and protects underlying components from moisture and physical abrasion.

Abstract: The present invention involves a metal alloy heat sink containing tungsten, copper, and nickel. The heat sink is affixed to a ceramic substrate which supports one or more heat-generating electrical components. By adjusting the ratio of tungsten, copper, and nickel, substantial matching of the heat sink CTE with the substrate CTE is possible. Because the CTE of the heat sink is matched with that of the substrate, problems associated with differential thermal expansion are minimized, including micro-cracking and delamination. In addition, the completed heat sink has a relatively high thermal conductivity, and is capable of dissipating substantial amounts of heat.

Abstract: A coating of metallic material is deposited on the internal surface of a hollow object. An elongate member comprising two electrical conductors extending side-by-side from end-to-end of the member has one end inside the hollow object and its opposite end outside the object. A filament has its two ends connected to the conductors respectively at the one end of the elongate member, and a crucible containing metal to be deposited is supported above the filament and in spaced relationship thereto. By supplying current to the filament by way of the conductors for the filament is heated to achieve thermonic emission. The filament and the crucible are connected to negative and positive terminals respectively of a potential source so that electrons emitted by the filament are accelerated towards the crucible and cause the crucible to be heated by electron bombardment.

Abstract: Metallic sputtering targets having minimal mobile ion contamination are produced by forming a compacted slab of particles of the constituent metal(s) in an isostatic pressing operation. The slab is then transferred to a heat resistant support faced with a material, such as alumina, that is inert at high temperatures. Next, the supported slab is placed in a vacuum oven and heated to a temperature sufficient to bond the metal particles together and volatilize mobile ion contaminants. The sintered slab is usable as a cathodic sputtering target with minimal additional treatment. The level of mobile ion contaminants in the completed target may be monitored by fabricating an MOS capacitor using the target, plotting its capacitance versus applied voltage over a suitable range, then measuring the extent to which the plot shifts after a high temperature-positive bias stress treatment.