Patents by Inventor EBEN KUNZ

EBEN KUNZ has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230300552
    Abstract: A system for providing augmented spatialized audio in a vehicle, including a plurality of speakers disposed in a perimeter of a cabin of the vehicle; and a controller configured to receive a position signal indicative of the position of a first user's head in the vehicle and to output to a first binaural device, according to the first position signal, a first spatial audio signal, such that the first binaural device produces a first spatial acoustic signal perceived by the first user as originating from a first virtual source location within the vehicle cabin, wherein the first spatial audio signal comprises at least an upper range of a first content signal, wherein the controller is further configured to drive the plurality of speakers with a driving signal such that a first bass content of the first content signal is produced in the vehicle cabin.
    Type: Application
    Filed: May 25, 2023
    Publication date: September 21, 2023
    Applicant: Bose Corporation
    Inventors: Remco Terwal, Yaduvir Singh, Eben Kunz, Charles Oswald, Michael S. Dublin
  • Patent number: 11700497
    Abstract: A system for providing augmented spatialized audio in a vehicle, including a plurality of speakers disposed in a perimeter of a cabin of the vehicle; and a controller configured to receive a position signal indicative of the position of a first user's head in the vehicle and to output to a first binaural device, according to the first position signal, a first spatial audio signal, such that the first binaural device produces a first spatial acoustic signal perceived by the first user as originating from a first virtual source location within the vehicle cabin, wherein the first spatial audio signal comprises at least an upper range of a first content signal, wherein the controller is further configured to drive the plurality of speakers with a driving signal such that a first bass content of the first content signal is produced in the vehicle cabin.
    Type: Grant
    Filed: October 30, 2020
    Date of Patent: July 11, 2023
    Assignee: Bose Corporation
    Inventors: Remco Terwal, Yaduvir Singh, Eben Kunz, Charles Oswald, Michael S. Dublin
  • Publication number: 20220141608
    Abstract: A system for providing augmented spatialized audio in a vehicle, including a plurality of speakers disposed in a perimeter of a cabin of the vehicle; and a controller configured to receive a position signal indicative of the position of a first user's head in the vehicle and to output to a first binaural device, according to the first position signal, a first spatial audio signal, such that the first binaural device produces a first spatial acoustic signal perceived by the first user as originating from a first virtual source location within the vehicle cabin, wherein the first spatial audio signal comprises at least an upper range of a first content signal, wherein the controller is further configured to drive the plurality of speakers with a driving signal such that a first bass content of the first content signal is produced in the vehicle cabin.
    Type: Application
    Filed: October 30, 2020
    Publication date: May 5, 2022
    Applicant: Bose Corporation
    Inventors: Remco Terwal, Yaduvir Singh, Eben Kunz, Charles Oswald, Michael S. Dublin
  • Patent number: 9543243
    Abstract: Embodiments of the invention provide low-noise arrangements for very-large-scale integration (VLSI) differential input/output (I/O) structures (I/O pins, solder bumps, vias, etc.). Novel geometries are described for arranging differential pairs of I/O structures in perpendicular or near-perpendicular “quads.” The geometries effectively place one differential pair on or near the perpendicular bisector of its adjacent differential pair, such that field cancellation and differential reception can substantially eliminate noise without the need for added spacing or shields. By exploiting these effects, embodiments can suppress noise, independent of I/O structure spacing, and arbitrarily small spacings are permitted. Such arrangements can be extended into running chains, and even further into arrays of parallel chains. The parallel chains can be separated by supply structures (e.g.
    Type: Grant
    Filed: November 7, 2014
    Date of Patent: January 10, 2017
    Assignee: Oracle International Corporation
    Inventors: Robert P. Masleid, Donald Arthur Draper, Eben Kunz, Laura Kocubinski
  • Publication number: 20160134262
    Abstract: Embodiments of the invention provide low-noise arrangements for very-large-scale integration (VLSI) differential input/output (I/O) structures (I/O pins, solder bumps, vias, etc.). Novel geometries are described for arranging differential pairs of I/O structures in perpendicular or near-perpendicular “quads.” The geometries effectively place one differential pair on or near the perpendicular bisector of its adjacent differential pair, such that field cancellation and differential reception can substantially eliminate noise without the need for added spacing or shields. By exploiting these effects, embodiments can suppress noise, independent of I/O structure spacing, and arbitrarily small spacings are permitted. Such arrangements can be extended into running chains, and even further into arrays of parallel chains. The parallel chains can be separated by supply structures (e.g.
    Type: Application
    Filed: November 7, 2014
    Publication date: May 12, 2016
    Inventors: ROBERT P. MASLEID, DONALD ARTHUR DRAPER, EBEN KUNZ, LAURA KOCUBINSKI