Abstract: The object of a device for coupling loading and unloading devices with semiconductor machines is to couple devices required for the use of SMIF technology with semiconductor processing machines in which subsequent integration of SMIF technology is not possible, wherein the charging to be carried out after coupling is highly flexible and capable of managing increasing dimensions of semiconductor wafers. An adjustable receiving element for the loading and unloading device is provided inside a movable enclosure, this receiving element being displaceable between at least two planes situated one above the other, one plane serving for charging the loading and unloading device and every other plane being used for the charging of the semiconductor machine carried out by the loading and unloading device. The enclosure has aligning and holding elements for fastening to a coupling element which is aligned with the semiconductor processing machine.