Patents by Inventor Eberhardt, Andre

Eberhardt, Andre has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Compensating element for stresses of thermal or mechanical orgin, especially for printed circuits, and process for making such an element employed in a printed circuit
    Patent number: 4857387
    Abstract: A printed circuit comprising an electrically insulating substrate and an electrically conductive layer on the substrate, this layer being a pseudo-elastic or elastically deformable alloy that undergoes significant deformations in a reversible manner and is a copper alloy containing at least 50% by weight copper in the form of large-grained polycrystals that undergo martensitic transformation. Preferably, the layer contains 60-80% by weight of copper, the large-grained polycrystals having a grain size of at least about 3 mm. The martensitic transformation takes place within the temperature range -55.degree. C. to +125.degree. C., and the layer has a thickness between 30.mu. and 200.mu., preferably about 100.mu..
    Type: Grant
    Filed: October 27, 1987
    Date of Patent: August 15, 1989
    Assignee: Cimulec, S.A.
    Inventors: Eberhardt, Andre, Serge Dominiak, Marcel Berveiller, Jean P. Lucas, Robert P. Y. Guyon