Patents by Inventor Ebony Mays

Ebony Mays has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • GAP-FILL FOR 3D NAND STAIRCASE
    Publication number: 20220375870
    Abstract: Systems, apparatuses, and methods may provide for technology that gap-fills stairwells for memory devices. The memory device is manufactured by forming a liner film on a trench of a stairwell layer of the memory device; depositing a doped silicon dioxide film on the liner film, wherein doping of the doped silicon dioxide film is performed during the deposition; and performing a pressurized and steamed anneal on the doped silicon dioxide film deposited on the liner film to form a reflowed doped silicon dioxide film.
    Type: Application
    Filed: August 5, 2022
    Publication date: November 24, 2022
    Inventors: Jung Chan Lee, Agus Tjandra, Ebony Mays
  • Multilayer interconnect structure containing air gaps and method for making
    Publication number: 20050037604
    Abstract: A novel air-gap-containing interconnect wiring structure is described incorporating a solid low-k dielectric in the via levels, and a composite solid plus air-gap dielectric in the wiring levels. Also provided is a method for forming such an interconnect structure. The method is readily scalable to interconnect structures containing multiple wiring levels, and is compatible with Dual Damascene Back End of the Line (BEOL) processing.
    Type: Application
    Filed: September 24, 2004
    Publication date: February 17, 2005
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Katherina Babich, Roy Carruthers, Timothy Dalton, Alfred Grill, Jeffrey Hedrick, Christopher Jahnes, Ebony Mays, Laurent Perraud, Sampath Purushothaman, Katherine Saenger