Abstract: A semiconductor component package and method of fabrication are disclosed. The package employs a heat dissipating element embedded within the protective material over the component. The heat dissipating element is preferably made by stamping, and is formed from an essentially uniform thickness heat conducting sheet. The element is formed so as to have two portions of different heights, the portion with the smaller height overlying but not touching the semiconductor component or wires connecting the semiconductor component.

Abstract: The present invention includes tab supports on the solder ball side of a BGA package substrate. The tab supports are preferably sized in a height direction to avoid or prevent a warped corner or edge of a BGA substrate from excessively pressing down on the solder balls when warping occurs, most often during the high temperature solder-reflow process. Exemplary tab supports comprise small standoff tabs placed in all four corners of the lower substrate of a BGA package, and/or on all four edges of the lower substrate. The invention has particular application to a plastic BGA (PBGA) package.