Abstract: The invention relates to a method for making contact with a semiconductor (10), and to a contact arrangement (1) for a semiconductor (10), wherein the semiconductor (10) is a really connected to a first contact partner (20) at at least one first area by the formation of a first soldering layer (30) having a predefined thickness. According to the invention, a polyimide layer (14) is applied as delimiting means on the semiconductor (10), said polyimide layer predefining the dimensions and/or the form of at least one soldering area (12) of the semiconductor (10).

Abstract: The invention relates to a method for making contact with a semiconductor (10), and to a contact arrangement (1) for a semiconductor (10), wherein the semiconductor (10) is a really connected to a first contact partner (20) at at least one first area by the formation of a first soldering layer (30) having a predefined thickness. According to the invention, a polyimide layer (14) is applied as delimiting means on the semiconductor (10), said polyimide layer predefining the dimensions and/or the form of at least one soldering area (12) of the semiconductor (10).

Abstract: The invention relates to a method for producing an electrical circuit. A prefabricated substrate is provided, said substrate having a first and a second conductor layer and having a dielectric between the first and the second conductor layers. According to the invention, the first conductor layer is multiple times thicker than the second conductor layer. At least one component to be cooled is mounted on the first conductor layer of the prefabricated substrate, forming a heat-transferring connection between the component and the first conductor layer. The invention further relates to an electrical circuit produced in said manner. According to the invention, the electrical circuit comprises a prefabricated substrate which is produced having a first and a second conductor layer and a dielectric located therebetween. According to the invention, the first conductor layer is multiple times thicker than the second conductor layer. At least one component to be cooled is mounted on the first conductor layer.

Abstract: The invention relates to a motor arrangement, in particular for use in an electronic steering system, comprising a polyphase motor (1) in a motor housing (10); a housing element (14), which forms a part of the motor housing (10); an electronic isolating relay module (2, 40) in order to switch one or more motor phases such that their current does not flow in the event of a fault; wherein the isolating relay module (2, 40) is arranged in the housing interior on one side of the housing element (14).

Abstract: The invention relates to a motor arrangement, in particular for use in an electronic steering system, comprising a polyphase motor (1) in a motor housing (10); a housing element (14), which forms a part of the motor housing (10); an electronic isolating relay module (2, 40) in order to switch one or more motor phases such that their current does not flow in the event of a fault; wherein the isolating relay module (2, 40) is arranged in the housing interior on one side of the housing element (14).