Abstract: Cleaning solution for cleaning and/or wetting metal surfaces, comprising at least one acid, a first surfactant, which is an alkyl-poly(ethyleneglycol-co-propyleneglycol)-ether having a cloud point of ?25° C., a second surfactant, which is selected from the group consisting of i) an alkyl-poly(ethyleneglycol-co-propyleneglycol)-ether having a cloud point of ?30° C., ii) an alkyl-polyethyleneglycol-ether having a cloud point of ?45° C. wherein the cloud points are determined according to European Standard EN 1890:2006, item 8.2 of German Version, with the modification that 10 wt % H2SO4 is used as solvent and that the concentration of the surfactant is 1000 mg/L.

Abstract: Cleaning solution for cleaning and/or wetting metal surfaces, comprising at least one acid, a first surfactant, which is an alkyl-poly(ethyleneglycol-co-propyleneglycol)-ether having a cloud point of ?25° C., a second surfactant, which is selected from the group consisting of i) an alkyl-poly(ethyleneglycol-co-propyleneglycol)-ether having a cloud point of ?30° C., ii) an alkyl-polyethyleneglycol-ether having a cloud point of ?45° C. wherein the cloud points are determined according to European Standard EN 1890:2006, item 8.2 of German Version, with the modification that 10 wt % H2SO4 is used as solvent and that the concentration of the surfactant is 1000 mg/L.

Abstract: For manufacturing substrate materials which are needed for the manufacture of electrical circuit carriers, methods are known in which metal layers are applied to a dielectric substrate by means of a glow discharge process and thereafter additional metal layers are applied by means of electroplating processes. These methods however are not suitable for the manufacture of substrate materials which are suitable for high frequency applications in the gigahertz range. The invention starts from the previously-mentioned methods and solves the described problem through the use of fluoropolymers and through coating of these materials by means of a glow discharge process with nickel, since by this means even very smooth surfaces of the substrate can be securely coated. The metallised materials can be coated with additional metal layers from electroless or electrolytic deposition baths.