Abstract: The invention relates to a method for improving the ohmic-contact behaviour between a contact grid and an emitter layer of a silicon solar cell, in which, in a treatment step, a treatment current flow having a current density of 200 A/cm2 to 20,000 A/cm2 in relation to the treatment section is induced while biasing and illuminating the silicon solar cell. The object of the invention is to improve the method for improving the ohmic-contact behaviour between a contact grid and an emitter layer of a silicon solar cell. In particular, it should be possible to quantify the improvement achieved by the method while implementing the method. Furthermore, any damage resulting from the application of unfavourable process parameters should be detected while the method is being implemented.

Abstract: Method for manufacturing an solar cell device, characterized in that the method comprises among others the following steps: arranging solar cell units (1) and electrically insulating units (2) alternatingly next to each other; applying rear soldering ribbons (3) to the rear side of the solar cell units (1) and the electrically insulating units (2); applying front soldering ribbons (4) to the front side of the solar cell units (1) and the electrically insulating units (2); soldering the rear soldering ribbons (3) and the front soldering ribbons (4) to the solar cell units (1), thereby providing an assembled solar cell. The invention also comprises a solar cell manufactured by means of the method.

Abstract: The present invention relates to photovoltaic modules with a plurality of separated photovoltaic elements (3). There is provided a product which utilizes the incident light in the areas in between the elements and a method for production thereof. The area in between the elements is covered by a liquid polymer (2) which is formed into V-grooves and cured and may be covered by a reflective layer.

Abstract: A solar cell module comprises a light receiving structure with a substantially transparent front cover and a plurality of active elements placed behind the said front cover. At least one interconnector is situated between adjacent active elements, the interconnectors having a reflective structure facing towards said front cover.