Patents by Inventor Eckhard Langer

Eckhard Langer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Interface void monitoring in a damascene process
    Publication number: 20020168786
    Abstract: For determining the quality of interconnections in integrated circuits, especially in damascene applications, a method of monitoring voids is disclosed, wherein a barrier metal layer is directly deposited on a planarized metal to provide a large-area surface that is not required to be destroyed for further analysis of the interface between the metal and the barrier metal layer. The analysis may be carried out by employing an electron microscope operated in a back-scatter mode.
    Type: Application
    Filed: April 11, 2002
    Publication date: November 14, 2002
    Inventors: Eckhard Langer, Frank Koschinsky, Volker Kahlert, Peter Hubler